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Chemical content PDTA144EMB

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Type numberPackagePackage descriptionTotal product weight
PDTA144EMBSOT883BXQFN30.70995 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065929315612601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32115
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04424
Phenolic resinProprietary0.0004113.530000.05717
subTotal0.00300100.000000.42256
DieDoped siliconSilicon (Si)7440-21-30.06000100.000008.45130
subTotal0.06000100.000008.45130
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09465
Copper (Cu)7440-50-80.2632094.0000037.07303
Tin (Sn)7440-31-50.000670.240000.09465
Zinc (Zn)7440-66-60.000590.210000.08282
Pure metal layerGold (Au)7440-57-50.000220.080000.03155
Nickel (Ni)7440-02-00.013834.940001.94831
Palladium (Pd)7440-05-30.000810.290000.11437
subTotal0.28000100.0000039.43938
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.01486
Silica fused60676-86-00.2040060.0000028.73442
Flame retardantMetal hydroxideProprietary0.010203.000001.43672
ImpurityBismuth (Bi)7440-69-90.001700.500000.23945
PigmentCarbon black1333-86-40.001700.500000.23945
PolymerEpoxy resin systemProprietary0.023807.000003.35235
Phenolic resinProprietary0.020406.000002.87344
subTotal0.34000100.0000047.89069
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00156
Tin solderTin (Sn)7440-31-50.0199999.940002.81541
subTotal0.02000100.000002.81710
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0069599.990000.97941
subTotal0.00695100.000000.97951
total0.70995100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.