Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD12VV1BL-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD12VV1BL-QSOD882DFN1006-20.953904 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346655053151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.796726
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.109759
Phenolic resinProprietary0.00135313.5300000.141838
subTotal0.010000100.0000001.048324
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000006.289941
subTotal0.060000100.0000006.289941
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000040.612997
Magnesium (Mg)7439-95-40.0008200.2000000.085963
Nickel (Ni)7440-02-00.0129153.1500001.353910
Silicon (Si)7440-21-30.0028290.6900000.296571
Pure metal layerGold (Au)7440-57-50.0001230.0300000.012894
Nickel (Ni)7440-02-00.0052071.2700000.545862
Palladium (Pd)7440-05-30.0006970.1700000.073068
subTotal0.410000100.00000042.981264
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000010.850148
Silica fused60676-86-00.27000060.00000028.304735
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.415237
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.235873
PigmentCarbon black1333-86-40.0022500.5000000.235873
PolymerEpoxy resin systemProprietary0.0315007.0000003.302219
Phenolic resinProprietary0.0270006.0000002.830474
subTotal0.450000100.00000047.174558
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000094
Non hazardousProprietary0.0000110.0555000.001164
Tin solderTin (Sn)7440-31-50.01998899.9400002.095389
subTotal0.020000100.0000002.096647
WireImpurityNon hazardousProprietary0.0000000.0100000.000041
Pure metalGold (Au)7440-57-50.00390499.9900000.409225
subTotal0.003904100.0000000.409266
total0.953904100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.