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Chemical content PESD1LVDS

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Type numberPackagePackage descriptionTotal product weight
PESD1LVDSSOT1165-2 SOT1165-1XSON105.40200 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340659051151412601235D-22529 HAMBURG, Germany; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.015005.000000.27767
FillerAluminium Trioxide (Al2O3)1344-28-10.1200040.000002.22140
PolymerBisphenol A-epichlorohydrin resin25068-38-60.0300010.000000.55535
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0450015.000000.83302
Resin systemProprietary0.0900030.000001.66605
subTotal0.30000100.000005.55349
DieDoped siliconSilicon (Si)7440-21-30.16000100.000002.96187
subTotal0.16000100.000002.96187
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-80.8730097.0000016.16068
Nickel (Ni)7440-02-00.027003.000000.49981
subTotal0.90000100.0000016.66049
Mould CompoundFillerSilica -amorphous-7631-86-90.292507.500005.41466
Silica fused60676-86-03.0283577.6500056.05979
Flame retardantNon hazardousProprietary0.214505.500003.97075
HardenerPhenolic resinProprietary0.136503.500002.52684
PigmentCarbon black1333-86-40.003900.100000.07220
PolymerEpoxy resin systemProprietary0.224255.750004.15124
subTotal3.90000100.0000072.19548
Pre-PlatingPure metal layerGold (Au)7440-57-50.001001.000000.01851
Nickel (Ni)7440-02-00.0970097.000001.79563
Palladium (Pd)7440-05-30.002002.000000.03702
subTotal0.10000100.000001.85116
WirePure metalGold (Au)7440-57-50.0415899.000000.76971
Palladium (Pd)7440-05-30.000421.000000.00777
subTotal0.04200100.000000.77748
total5.40200100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.