×

Chemical content PESD3V3S2UQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD3V3S2UQSOT663SOT32.52536 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340578391151312601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10000100.000003.95983
subTotal0.10000100.000003.95983
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.000760.080000.03009
Carbon (C)7440-44-00.000380.040000.01505
Chromium (Cr)7440-47-30.002000.210000.07900
Cobalt (Co)7440-48-40.003990.420000.15800
Iron (Fe)7439-89-60.4438446.7200017.57532
Manganese (Mn)7439-96-50.007980.840000.31599
Nickel (Ni)7440-02-00.3344035.2000013.24168
Phosphorus (P)7723-14-00.000190.020000.00752
Silicon (Si)7440-21-30.002380.250000.09405
Sulphur (S)7704-34-90.000190.020000.00752
Pure metal layerCopper (Cu)7440-50-80.1227412.920004.86030
Silver (Ag)7440-22-40.031163.280001.23388
subTotal0.95000100.0000037.61840
Mould CompoundFillerSilica fused60676-86-01.0082071.0000039.92302
PigmentCarbon black1333-86-40.004260.300000.16869
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.2797419.7000011.07723
Phenolic resinProprietary0.127809.000005.06066
subTotal1.42000100.0000056.22960
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00009
Tin solderTin (Sn)7440-31-50.0440099.990001.74215
subTotal0.04400100.000001.74233
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0113699.990000.44979
subTotal0.01136100.000000.44983
total2.52536100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.