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Chemical content PMDPB58UPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMDPB58UPESOT1118 dummy POVHUSON67.33677 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066845115412601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01063
FillerSilver (Ag)7440-22-40.0655284.000000.89304
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10631
Isobornyl Methacrylate7534-94-30.003905.000000.05316
subTotal0.07800100.000001.06314
DieDoped siliconSilicon (Si)7440-21-30.42000100.000005.72459
subTotal0.42000100.000005.72459
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100034.88470
Magnesium (Mg)7439-95-40.005380.200000.07336
Nickel (Ni)7440-02-00.085303.170001.16270
Silicon (Si)7440-21-30.018570.690000.25308
Pure metal layerGold (Au)7440-57-50.000540.020000.00734
Nickel (Ni)7440-02-00.019910.740000.27142
Palladium (Pd)7440-05-30.001880.070000.02567
subTotal2.69100100.0000036.67827
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.18847
Silica fused60676-86-02.3328060.0000031.79601
Flame retardantMetal hydroxideProprietary0.116643.000001.58980
ImpurityBismuth (Bi)7440-69-90.019440.500000.26497
PigmentCarbon black1333-86-40.019440.500000.26497
PolymerEpoxy resin systemProprietary0.272167.000003.70953
Phenolic resinProprietary0.233286.000003.17960
subTotal3.88800100.0000052.99335
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00124
Tin solderTin (Sn)7440-31-50.1639099.940002.23397
subTotal0.16400100.000002.23531
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalGold (Au)7440-57-50.0091799.990000.12495
subTotal0.00917100.000000.12496
WirePure metalGold (Au)7440-57-50.08660100.000001.18038
subTotal0.08660100.000001.18038
total7.33677100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.