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Chemical content PMEG120G30ELP

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Type numberPackagePackage descriptionTotal product weight
PMEG120G30ELPSOD128FlatPower32.83700 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660587115312601235Cardiff, Great Britain; Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.74000100.000002.25356
subTotal0.74000100.000002.25356
ClipCopper alloyCopper (Cu)7440-50-85.2097099.8600015.86532
Iron (Fe)7439-89-60.005220.100000.01589
Phosphorus (P)7723-14-00.002090.040000.00636
subTotal5.21700100.0000015.88757
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200035.42724
Iron (Fe)7439-89-60.011820.100000.03600
Phosphorus (P)7723-14-00.003550.030000.01080
Pure metal layerSilver (Ag)7440-22-40.171391.450000.52194
subTotal11.82000100.0000035.99598
Mould CompoundFillerSilica -amorphous-7631-86-91.2210010.000003.71837
Silica fused60676-86-09.1575075.0000027.88775
PigmentCarbon black1333-86-40.036630.300000.11155
PolymerEpoxy resin systemProprietary0.940177.700002.86314
Phenolic resinProprietary0.854707.000002.60286
subTotal12.21000100.0000037.18367
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.06576
subTotal0.35000100.000001.06586
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500007.04236
Silver alloySilver (Ag)7440-22-40.062502.500000.19033
Tin alloyTin (Sn)7440-31-50.125005.000000.38067
subTotal2.50000100.000007.61336
total32.83700100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.