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Chemical content PMEG150G20ELP-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG150G20ELP-QSOD128FlatPower32.66700 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662758115212601235Seremban, Malaysia; Cardiff, Great Britain; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.57000100.000001.74488
subTotal0.57000100.000001.74488
ClipCopper alloyCopper (Cu)7440-50-85.2097099.8600015.94789
Iron (Fe)7439-89-60.005220.100000.01597
Phosphorus (P)7723-14-00.002090.040000.00639
subTotal5.21700100.0000015.97025
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200035.61161
Iron (Fe)7439-89-60.011820.100000.03618
Phosphorus (P)7723-14-00.003550.030000.01085
Pure metal layerSilver (Ag)7440-22-40.171391.450000.52466
subTotal11.82000100.0000036.18330
Mould CompoundFillerSilica -amorphous-7631-86-91.2210010.000003.73772
Silica fused60676-86-09.1575075.0000028.03288
PigmentCarbon black1333-86-40.036630.300000.11213
PolymerEpoxy resin systemProprietary0.940177.700002.87804
Phenolic resinProprietary0.854707.000002.61640
subTotal12.21000100.0000037.37717
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.07131
subTotal0.35000100.000001.07141
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500007.07901
Silver alloySilver (Ag)7440-22-40.062502.500000.19132
Tin alloyTin (Sn)7440-31-50.125005.000000.38265
subTotal2.50000100.000007.65298
total32.66700100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.