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Chemical content PMEG150G20ELP

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Type numberPackagePackage descriptionTotal product weight
PMEG150G20ELPSOD128FlatPower20.35700 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660588115412601235Cardiff, Great Britain; D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.57000100.000002.80002
subTotal0.57000100.000002.80002
ClipCopper alloyCopper (Cu)7440-50-85.2097099.8600025.59167
Iron (Fe)7439-89-60.005220.100000.02563
Phosphorus (P)7723-14-00.002090.040000.01025
subTotal5.21700100.0000025.62755
Lead FrameCopper alloyCopper (Cu)7440-50-812.1607399.5150059.73735
Iron (Fe)7439-89-60.011490.094000.05643
Phosphorus (P)7723-14-00.004280.035000.02101
Pure metal layerCopper (Cu)7440-50-80.001220.010000.00600
Silver (Ag)7440-22-40.042280.346000.20770
subTotal12.22000100.0000060.02849
Mould CompoundFillerSilica -amorphous-7631-86-90.1000010.000000.49123
Silica fused60676-86-00.7500075.000003.68424
PigmentCarbon black1333-86-40.003000.300000.01474
PolymerEpoxy resin systemProprietary0.077007.700000.37825
Phenolic resinProprietary0.070007.000000.34386
subTotal1.00000100.000004.91232
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000020.005000.00009
Tin solderTin (Sn)7440-31-50.3499699.990001.71914
subTotal0.35000100.000001.71932
Solder PasteImpurityAntimony (Sb)7440-36-00.000300.030000.00147
Lead alloyLead (Pb)7439-92-10.9247092.470004.54242
Silver (Ag)7440-22-40.025002.500000.12281
Tin (Sn)7440-31-50.050005.000000.24562
subTotal1.00000100.000004.91232
total20.35700100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.