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Chemical content PMEG4020EPA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG4020EPASOT1061HUSON37.93705 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340634861151012601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01386
FillerSilver (Ag)7440-22-40.0924084.000001.16416
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.13859
Isobornyl Methacrylate7534-94-30.005505.000000.06930
subTotal0.11000100.000001.38591
DieDoped siliconSilicon (Si)7440-21-30.59000100.000007.43349
subTotal0.59000100.000007.43349
Lead FrameCopper alloyCopper (Cu)7440-50-82.5800192.9400032.50596
Magnesium (Mg)7439-95-40.004720.170000.05946
Nickel (Ni)7440-02-00.086063.100001.08423
Silicon (Si)7440-21-30.019430.700000.24483
Pure metal layerGold (Au)7440-57-50.001110.040000.01399
Nickel (Ni)7440-02-00.077452.790000.97581
Palladium (Pd)7440-05-30.007220.260000.09094
subTotal2.77600100.0000034.97522
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.22006
FillerSilica -amorphous-7631-86-90.012350.290000.15565
Silica fused60676-86-03.6699986.1500046.23872
HardenerPhenolic resinProprietary0.182754.290002.30254
PigmentCarbon black1333-86-40.008090.190000.10198
PolymerEpoxy resin systemProprietary0.369348.670004.65339
subTotal4.26000100.0000053.67234
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00119
Tin solderTin (Sn)7440-31-50.1699099.940002.14057
subTotal0.17000100.000002.14186
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0310599.990000.39117
subTotal0.03105100.000000.39121
total7.93705100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.