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Chemical content PMPB13XNE

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Type numberPackagePackage descriptionTotal product weight
PMPB13XNESOT1220SOT12207.40554 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066867184012601235Kuching Sarawak, Malaysia; Dongguan, China 
934066867115712601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00945
FillerSilver (Ag)7440-22-40.0588084.000000.79400
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09452
Isobornyl Methacrylate7534-94-30.003505.000000.04726
subTotal0.07000100.000000.94523
DieDoped siliconSilicon (Si)7440-21-30.49800100.000006.72470
subTotal0.49800100.000006.72470
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.52553
Magnesium (Mg)7439-95-40.004220.145900.05694
Nickel (Ni)7440-02-00.084352.918801.13906
Silicon (Si)7440-21-30.018280.632400.24679
Pure metal layerGold (Au)7440-57-50.000960.033300.01300
Nickel (Ni)7440-02-00.074012.561000.99943
Palladium (Pd)7440-05-30.003270.113000.04410
subTotal2.89000100.0000039.02485
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.58457
Silica fused60676-86-02.2380060.0000030.22062
Flame retardantMetal hydroxideProprietary0.111903.000001.51103
ImpurityBismuth (Bi)7440-69-90.018650.500000.25184
PigmentCarbon black1333-86-40.018650.500000.25184
PolymerEpoxy resin systemProprietary0.261107.000003.52574
Phenolic resinProprietary0.223806.000003.02206
subTotal3.73000100.0000050.36770
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00127
Tin solderTin (Sn)7440-31-50.1699099.940002.29420
subTotal0.17000100.000002.29557
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalCopper (Cu)7440-50-80.0475499.990000.64189
subTotal0.04754100.000000.64195
total7.40554100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.