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Chemical content PMPB14R0EP

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Type numberPackagePackage descriptionTotal product weight
PMPB14R0EPSOT1220-2DFN2020M-67.08615 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661981115412601235Dongguan, China; Hsin-chu, Taiwan; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001161.000000.01637
FillerSilver (Ag)7440-22-40.0974484.000001.37508
PolymerBismaleimidodiphenylmethane resin 0.0116010.000000.16370
Isobornyl Methacrylate7534-94-30.005805.000000.08185
subTotal0.11600100.000001.63700
DieDoped siliconSilicon (Si)7440-21-30.47300100.000006.67499
subTotal0.47300100.000006.67499
Lead FrameCopper alloyCopper (Cu)7440-50-82.6919895.6300037.98938
Magnesium (Mg)7439-95-40.004220.150000.05959
Nickel (Ni)7440-02-00.083892.980001.18382
Silicon (Si)7440-21-30.018300.650000.25821
Pure metal layerGold (Au)7440-57-50.000280.010000.00397
Nickel (Ni)7440-02-00.015480.550000.21849
Palladium (Pd)7440-05-30.000840.030000.01192
subTotal2.81500100.0000039.72538
Mould CompoundFillerSilica -amorphous-7631-86-90.8277723.0000011.68152
Silica fused60676-86-02.1594060.0000030.47353
Flame retardantMetal hydroxideProprietary0.107973.000001.52368
ImpurityBismuth (Bi)7440-69-90.018000.500000.25395
PigmentCarbon black1333-86-40.018000.500000.25395
PolymerEpoxy resin systemProprietary0.251937.000003.55525
Phenolic resinProprietary0.215946.000003.04735
subTotal3.59900100.0000050.78923
WireImpurityNon hazardousProprietary0.000010.010000.00012
Pure metalCopper (Cu)7440-50-80.0831499.990001.17332
subTotal0.08315100.000001.17344
total7.08615100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.