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Chemical content PMPB15XPA

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Type numberPackagePackage descriptionTotal product weight
PMPB15XPASOT1220SOT12207.40396 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070926115312601235Dongguan, China; Kuching Sarawak, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00945
FillerSilver (Ag)7440-22-40.0588084.000000.79417
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09454
Isobornyl Methacrylate7534-94-30.003505.000000.04727
subTotal0.07000100.000000.94543
DieDoped siliconSilicon (Si)7440-21-30.49800100.000006.72613
subTotal0.49800100.000006.72613
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.53333
Magnesium (Mg)7439-95-40.004220.145900.05695
Nickel (Ni)7440-02-00.084352.918801.13930
Silicon (Si)7440-21-30.018280.632400.24685
Pure metal layerGold (Au)7440-57-50.000960.033300.01300
Nickel (Ni)7440-02-00.074012.561000.99964
Palladium (Pd)7440-05-30.003270.113000.04411
subTotal2.89000100.0000039.03318
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.58704
Silica fused60676-86-02.2380060.0000030.22707
Flame retardantMetal hydroxideProprietary0.111903.000001.51135
ImpurityBismuth (Bi)7440-69-90.018650.500000.25189
PigmentCarbon black1333-86-40.018650.500000.25189
PolymerEpoxy resin systemProprietary0.261107.000003.52649
Phenolic resinProprietary0.223806.000003.02271
subTotal3.73000100.0000050.37844
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00127
Tin solderTin (Sn)7440-31-50.1699099.940002.29469
subTotal0.17000100.000002.29606
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalCopper (Cu)7440-50-80.0459699.990000.62071
subTotal0.04596100.000000.62077
total7.40396100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.