×

Chemical content PMPB24EP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB24EPSOT1220SOT12207.29877 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660839115312601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00959
FillerSilver (Ag)7440-22-40.0588084.000000.80562
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09591
Isobornyl Methacrylate7534-94-30.003505.000000.04795
subTotal0.07000100.000000.95907
DieDoped siliconSilicon (Si)7440-21-30.39000100.000005.34337
subTotal0.39000100.000005.34337
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956037.05984
Magnesium (Mg)7439-95-40.004220.145900.05777
Nickel (Ni)7440-02-00.084352.918801.15572
Silicon (Si)7440-21-30.018280.632400.25040
Pure metal layerGold (Au)7440-57-50.000960.033300.01319
Nickel (Ni)7440-02-00.074012.561001.01405
Palladium (Pd)7440-05-30.003270.113000.04474
subTotal2.89000100.0000039.59571
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.75404
Silica fused60676-86-02.2380060.0000030.66270
Flame retardantMetal hydroxideProprietary0.111903.000001.53314
ImpurityBismuth (Bi)7440-69-90.018650.500000.25552
PigmentCarbon black1333-86-40.018650.500000.25552
PolymerEpoxy resin systemProprietary0.261107.000003.57732
Phenolic resinProprietary0.223806.000003.06627
subTotal3.73000100.0000051.10451
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00129
Tin solderTin (Sn)7440-31-50.1699099.940002.32776
subTotal0.17000100.000002.32915
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalCopper (Cu)7440-50-80.0487699.990000.66810
subTotal0.04877100.000000.66817
total7.29877100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.