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Chemical content PMPB27EP

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Type numberPackagePackage descriptionTotal product weight
PMPB27EPSOT1220SOT12207.45384 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066875115912601235Kuching Sarawak, Malaysia; Dongguan, China 
934066875184112601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00939
FillerSilver (Ag)7440-22-40.0588084.000000.78886
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09391
Isobornyl Methacrylate7534-94-30.003505.000000.04696
subTotal0.07000100.000000.93912
DieAluminium alloyAluminium (Al)7429-90-50.001480.280000.01991
Doped siliconSilicon (Si)7440-21-30.5285299.720007.09052
subTotal0.53000100.000007.11043
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.28885
Magnesium (Mg)7439-95-40.004220.145900.05657
Nickel (Ni)7440-02-00.084352.918801.13168
Silicon (Si)7440-21-30.018280.632400.24519
Pure metal layerGold (Au)7440-57-50.000960.033300.01291
Nickel (Ni)7440-02-00.074012.561000.99295
Palladium (Pd)7440-05-30.003270.113000.04381
subTotal2.89000100.0000038.77196
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.50950
Silica fused60676-86-02.2380060.0000030.02479
Flame retardantMetal hydroxideProprietary0.111903.000001.50124
ImpurityBismuth (Bi)7440-69-90.018650.500000.25021
PigmentCarbon black1333-86-40.018650.500000.25021
PolymerEpoxy resin systemProprietary0.261107.000003.50289
Phenolic resinProprietary0.223806.000003.00248
subTotal3.73000100.0000050.04132
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00127
Tin solderTin (Sn)7440-31-50.1699099.940002.27934
subTotal0.17000100.000002.28071
WireImpurityNon hazardousProprietary0.000010.010000.00009
Pure metalCopper (Cu)7440-50-80.0638399.990000.85635
subTotal0.06384100.000000.85644
total7.45384100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.