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Chemical content PMZ130UNE

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Type numberPackagePackage descriptionTotal product weight
PMZ130UNESOT883XQFN30.90272 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068608315412601235D-22529 HAMBURG, Germany; Hsinchu, Taiwan; Hsin-chu, Taiwan; Dongguan, China; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.84190
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11598
Phenolic resinProprietary0.0013513.530000.14988
subTotal0.01000100.000001.10776
DieDoped siliconSilicon (Si)7440-21-30.06000100.000006.64658
subTotal0.06000100.000006.64658
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100044.49475
Magnesium (Mg)7439-95-40.000630.146000.06955
Nickel (Ni)7440-02-00.012532.913001.38757
Silicon (Si)7440-21-30.002710.631000.30057
MetallisationGold (Au)7440-57-50.000150.035000.01667
Nickel (Ni)7440-02-00.011852.755001.31231
Palladium (Pd)7440-05-30.000470.110000.05240
subTotal0.43000100.0000047.63382
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.42706
Silica fused60676-86-00.2220060.0000024.59234
Flame retardantMetal hydroxideProprietary0.011103.000001.22962
ImpurityBismuth (Bi)7440-69-90.001850.500000.20494
PigmentCarbon black1333-86-40.001850.500000.20494
PolymerEpoxy resin systemProprietary0.025907.000002.86911
Phenolic resinProprietary0.022206.000002.45923
subTotal0.37000100.0000040.98724
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00061
Tin solderTin (Sn)7440-31-50.0099999.940001.10710
subTotal0.01000100.000001.10776
WireImpurityNon hazardousProprietary0.000000.010000.00025
Pure metalGold (Au)7440-57-50.0227299.990002.51659
subTotal0.02272100.000002.51684
total0.90272100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.