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Chemical content PRMD10

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PRMD10SOT1268-1DFN1412-62.37600 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070172147312601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1064076.000004.47811
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0146610.470000.61692
Phenolic resinProprietary0.0189413.530000.79722
subTotal0.14000100.000005.89225
DieDoped siliconSilicon (Si)7440-21-30.04000100.000001.68350
subTotal0.04000100.000001.68350
DieDoped siliconSilicon (Si)7440-21-30.04000100.000001.68350
subTotal0.04000100.000001.68350
Lead FrameCopper alloyCopper (Cu)7440-50-80.9185195.6780038.65778
Magnesium (Mg)7439-95-40.001430.149200.06028
Nickel (Ni)7440-02-00.028642.983701.20554
Silicon (Si)7440-21-30.006210.646500.26121
Pure metal layerGold (Au)7440-57-50.000110.011400.00461
Nickel (Ni)7440-02-00.004760.495500.20020
Palladium (Pd)7440-05-30.000340.035700.01442
subTotal0.96000100.0000040.40404
Mould CompoundFillerSilica -amorphous-7631-86-90.2599023.0000010.93855
Silica fused60676-86-00.6780060.0000028.53535
Flame retardantMetal hydroxideProprietary0.033903.000001.42677
ImpurityBismuth (Bi)7440-69-90.005650.500000.23779
PigmentCarbon black1333-86-40.005650.500000.23779
PolymerEpoxy resin systemProprietary0.079107.000003.32912
Phenolic resinProprietary0.067806.000002.85354
subTotal1.13000100.0000047.55891
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000030.055500.00117
Tin solderTin (Sn)7440-31-50.0499799.940002.10311
subTotal0.05000100.000002.10437
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0160099.990000.67333
subTotal0.01600100.000000.67340
total2.37600100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.