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Chemical content PUSB3F97

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Type numberPackagePackage descriptionTotal product weight
PUSB3F97SOT1176-1XSON103.09594 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660108115812601235Bangkok, Thailand; Nijmegen, Netherlands; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0225045.000000.72676
PolymerAcrylic resinProprietary0.0075015.000000.24225
Phenolic resinProprietary0.0075015.000000.24225
Resin systemProprietary0.0125025.000000.40375
subTotal0.05000100.000001.61501
DieDoped siliconSilicon (Si)7440-21-30.08000100.000002.58403
subTotal0.08000100.000002.58403
Lead FrameCopper alloyCopper (Cu)7440-50-80.8986094.5900029.02527
Magnesium (Mg)7439-95-40.001620.170000.05217
Nickel (Ni)7440-02-00.041044.320001.32561
Silicon (Si)7440-21-30.006740.710000.21787
Pure metal layerGold (Au)7440-57-50.000280.030000.00921
Nickel (Ni)7440-02-00.001040.110000.03375
Palladium (Pd)7440-05-30.000480.050000.01534
Silver (Ag)7440-22-40.000190.020000.00614
subTotal0.95000100.0000030.68536
Mould CompoundFillerSilica -amorphous-7631-86-90.140007.000004.52205
Silica fused60676-86-01.6600083.0000053.61861
PigmentCarbon black1333-86-40.010000.500000.32300
PolymerEpoxy resin systemProprietary0.120006.000003.87604
Phenolic resinProprietary0.070003.500002.26103
subTotal2.00000100.0000064.60073
WirePure metalGold (Au)7440-57-50.0157899.000000.50972
Palladium (Pd)7440-05-30.000161.000000.00515
subTotal0.01594100.000000.51487
total3.09594100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.