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Chemical content PXP9R1-30QL

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Type numberPackagePackage descriptionTotal product weight
PXP9R1-30QLSOT8002-1MLPAK3322.31925 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662547118512601235Manchester, United Kingdom; Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.002311.000000.01035
FillerSilver (Ag)7440-22-40.1940484.000000.86938
PolymerBismaleimidodiphenylmethane resin 0.0231010.000000.10350
Isobornyl Methacrylate7534-94-30.011555.000000.05175
subTotal0.23100100.000001.03498
DieDoped siliconSilicon (Si)7440-21-31.01000100.000004.52524
subTotal1.01000100.000004.52524
Lead FrameCopper alloyCopper (Cu)7440-50-89.9547597.1100044.60162
Iron (Fe)7439-89-60.235772.300001.05637
Lead (Pb)7439-92-10.001030.010000.00459
Phosphorus (P)7723-14-00.007180.070000.03215
Zinc (Zn)7440-66-60.001030.010000.00459
Pure metal layerSilver (Ag)7440-22-40.051260.500000.22964
subTotal10.25100100.0000045.92896
Mould CompoundAdditiveNon hazardousProprietary0.041790.410000.18722
FillerSilica -amorphous-7631-86-90.029560.290000.13243
Silica fused60676-86-08.7804186.1500039.34007
HardenerPhenolic resinProprietary0.437244.290001.95901
PigmentCarbon black1333-86-40.019360.190000.08676
PolymerEpoxy resin systemProprietary0.883658.670003.95912
subTotal10.19200100.0000045.66461
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00008
Non hazardousProprietary0.000220.055500.00099
Tin solderTin (Sn)7440-31-50.3987699.940001.78662
subTotal0.39900100.000001.78769
WireImpurityNon hazardousProprietary0.000020.010000.00011
Pure metalCopper (Cu)7440-50-80.2362399.990001.05840
subTotal0.23625100.000001.05851
total22.31925100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.