74AUP1G57

Low-power configurable multiple function gate

The 74AUP1G57 is a configurable multiple function gate with Schmitt-trigger inputs. The device can be configured as any of the following logic functions AND, OR, NAND, NOR, XNOR, inverter and buffer; using the 3-bit input. All inputs can be connected directly to V_CC or GND. This device ensures very low static and dynamic power consumption across the entire V_CC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using I_OFF. The I_OFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

Wide supply voltage range from 0.8 V to 3.6 V
CMOS low power dissipation
High noise immunity
Overvoltage tolerant inputs to 3.6 V
Low noise overshoot and undershoot < 10 % of V_CC
I_OFF circuitry provides partial power-down mode operation
Latch-up performance exceeds 100 mA per JESD 78 Class II
Low static power consumption; I_CC = 0.9 μA (maximum)
Complies with JEDEC standards:
- JESD8-12 (0.8 V to 1.3 V)
- JESD8-11 (0.9 V to 1.65 V)
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C

Parametrics

Type number	Product status	V_CC (V)	Logic switching levels	Output drive capability (mA)	t_pd (ns)	f_max (MHz)	Nr of bits	Power dissipation considerations	T_amb (°C)	R_th(j-a) (K/W)	Ψ_th(j-top) (K/W)	R_th(j-c) (K/W)	Package name
74AUP1G57GM	Production	0.8 - 3.6	CMOS	± 1.9	8.7	70	1	ultra low	-40~125	290	6.5	145	XSON6
74AUP1G57GN	Production	0.8 - 3.6	CMOS	± 1.9	8.7	70	1	ultra low	-40~125	275	11.7	171	XSON6
74AUP1G57GS	Production	0.8 - 3.6	CMOS	± 1.9	8.7	70	1	ultra low	-40~125	272	14.8	177	XSON6
74AUP1G57GW	Production	0.8 - 3.6	CMOS	± 1.9	8.7	70	1	ultra low	-40~125	264	38.6	153	TSSOP6
74AUP1G57GX	Production	0.8 - 3.6	CMOS	± 1.9	8.7	70	1	ultra low	-40~125	-	-	-	X2SON6

Package

Type number	Package	Package information	Reflow-/Wave soldering	Packing	Status	Marking	Orderable part number, (Ordering code (12NC))
74AUP1G57GM	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_132	Active	aC	74AUP1G57GM,132 ( 9352 799 58132 )
74AUP1G57GM	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_115	Active	aC	74AUP1G57GM,115 ( 9352 799 58115 )
74AUP1G57GN	XSON6 (SOT1115)	SOT1115	REFLOW_BG-BD-1	SOT1115_132	Active	aC	74AUP1G57GN,132 ( 9352 917 43132 )
74AUP1G57GS	XSON6 (SOT1202)	SOT1202	REFLOW_BG-BD-1	SOT1202_132	Active	aC	74AUP1G57GS,132 ( 9352 928 67132 )
74AUP1G57GW	TSSOP6 (SOT363-2)	SOT363-2		SOT363-2_125	Active	aC	74AUP1G57GW,125 ( 9352 799 57125 )
74AUP1G57GX	X2SON6 (SOT1255-2)	SOT1255-2		SOT1255-2_147	Active	aC	74AUP1G57GXZ ( 9353 071 21147 )

Discontinuation information

Type number	Orderable part number, (Ordering code (12NC))	Last time buy date	Last time delivery date	Replacement product	Status	Comments
74AUP1G57GX	935307121125

Environmental information

Type number	Orderable part number	Chemical content	Leadfree conversion date
74AUP1G57GM	74AUP1G57GM,132	74AUP1G57GM	Always Pb-free
74AUP1G57GM	74AUP1G57GM,115	74AUP1G57GM	Always Pb-free
74AUP1G57GN	74AUP1G57GN,132	74AUP1G57GN	Always Pb-free
74AUP1G57GS	74AUP1G57GS,132	74AUP1G57GS	Always Pb-free
74AUP1G57GW	74AUP1G57GW,125	74AUP1G57GW	Always Pb-free
74AUP1G57GX	74AUP1G57GXZ	74AUP1G57GX	Always Pb-free

Quality and reliability disclaimer

Documentation (19)

File name	Title	Type	Date
74AUP1G57	Low-power configurable multiple function gate	Data sheet	2023-07-24
AN10161	PicoGate Logic footprints	Application note	2002-10-29
AN11052	Pin FMEA for AUP family	Application note	2019-01-09
aup1g57	aup1g57 IBIS model	IBIS model	2015-09-06
Nexperia_document_leaflet_Logic_X2SON_packages_062018	X2SON ultra-small 4, 5, 6 & 8-pin leadless packages	Leaflet	2018-06-05
Nexperia_document_leaflet_Logic_SingleConfigurableLogic_201812	Single configurable logic	Leaflet	2019-01-04
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Leaflet	2019-04-12
Nexperia_Selection_guide_2023	Nexperia Selection Guide 2023	Selection guide	2023-05-10
MAR_SOT1202	MAR_SOT1202 Topmark	Top marking	2013-06-03
SOT1202	plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body	Package information	2022-06-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
SOT363-2	plastic thin shrink small outline package; 6 leads; body width 1.25 mm	Package information	2022-11-21
SOT1255-2	plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm	Package information	2020-08-27
MAR_SOT1115	MAR_SOT1115 Topmark	Top marking	2013-06-03
SOT1115	plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body	Package information	2022-05-27
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
MAR_SOT886	MAR_SOT886 Topmark	Top marking	2013-06-03
SOT886	plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Package information	2022-06-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06

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Models

File name	Title	Type	Date
aup1g57	aup1g57 IBIS model	IBIS model	2015-09-06

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