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74AUP3G34

Low-power triple buffer

The 74AUP3G34 is a triple buffer.

Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial Power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78B Class II

  • Inputs accept voltages up to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

Parametrics

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
74AUP3G34DCProduction0.8 - 3.6CMOS± 1.9703ultra low-40~125203113VSSOP8
74AUP3G34GNProduction0.8 - 3.6CMOS± 1.9703ultra low-40~125238148XSON8
74AUP3G34GSProduction0.8 - 3.6CMOS± 1.9703ultra low-40~125276146XSON8
74AUP3G34GTProduction0.8 - 3.6CMOS± 1.9703ultra low-40~125327157XSON8
74AUP3G34GXProduction0.8 - 3.6CMOS± 1.9703ultra low-40~125--X2SON8

Package

Type numberPackagePackage informationReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
74AUP3G34DC
VSSOP8
(SOT765-1)
SOT765-1SOT765-1_125Activea3474AUP3G34DCH
( 9352 806 94125 )
74AUP3G34GN
XSON8
(SOT1116)
SOT1116REFLOW_BG-BD-1
SOT1116_115ActiveaA74AUP3G34GNX
( 9353 051 59115 )
74AUP3G34GS
XSON8
(SOT1203)
SOT1203REFLOW_BG-BD-1
SOT1203_115ActiveaA74AUP3G34GSX
( 9353 051 61115 )
74AUP3G34GT
XSON8
(SOT833-1)
SOT833-1SOT833-1_115Activea3474AUP3G34GTX
( 9352 806 95115 )
74AUP3G34GX
X2SON8
(SOT1233-2)
SOT1233-2SOT1233-2_115ActiveaA74AUP3G34GXX
( 9353 397 94115 )

Environmental information

Type numberOrderable part numberChemical contentRoHSRHF-indicatorLeadfree conversion date
74AUP3G34DC74AUP3G34DCH74AUP3G34DCAlways Pb-free
74AUP3G34GN74AUP3G34GNX74AUP3G34GNAlways Pb-free
74AUP3G34GS74AUP3G34GSX74AUP3G34GSAlways Pb-free
74AUP3G34GT74AUP3G34GTX74AUP3G34GTAlways Pb-free
74AUP3G34GX74AUP3G34GXX74AUP3G34GXweek 25, 2019
Quality and reliability disclaimer

Documentation (15)

File nameTitleTypeDate
74AUP3G34Low-power triple bufferData sheet2023-07-31
aup3g3474AUP3G34 IBIS ModelIBIS model2014-12-05
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
SOT1233-2plastic thermal enhanced extremely thin small outline package; no leads;8 terminals; body 1.35 x 0.8 x 0.32 mmPackage information2022-04-21
MAR_SOT1203MAR_SOT1203 TopmarkTop marking2013-06-03
SOT1203plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm bodyPackage information2022-06-03
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT833MAR_SOT833 TopmarkTop marking2013-06-03
SOT833-1plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm bodyPackage information2022-06-03
SOT765-1plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm bodyPackage information2022-06-03
MAR_SOT1116MAR_SOT1116 TopmarkTop marking2013-06-03
SOT1116plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm bodyPackage information2022-06-02
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

Support

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Models

File nameTitleTypeDate
aup3g3474AUP3G34 IBIS ModelIBIS model2014-12-05

Sample

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