74AUP1G175

Low-power D-type flip-flop with reset; positive-edge trigger

The 74AUP1G175 is a single positive edge triggered D-type flip-flop with individual data (D), clock (CP), master reset (MR) inputs, and Q output. The D-input that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition will be stored in the flip-flop and appear at the Q output. A LOW on MR causes the flip-flop and output to be reset to LOW. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire V_CC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using I_OFF. The I_OFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
CMOS low power dissipation
Complies with JEDEC standards:
- JESD8-12 (0.8 V to 1.3 V)
- JESD8-11 (0.9 V to 1.65 V)
- JESD8-7 (1.2 V to 1.95 V)
- JESD8-5 (1.8 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
Low static power consumption; I_CC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Overvoltage tolerant inputs to 3.6 V
Low noise overshoot and undershoot < 10 % of V_CC
I_OFF circuitry provides partial Power-down mode operation
Multiple package options
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C and -40 °C to +125 °C

Parametrics

Type number	Product status	V_CC (V)	Logic switching levels	Output drive capability (mA)	t_pd (ns)	f_max (MHz)	Power dissipation considerations	T_amb (°C)	R_th(j-a) (K/W)	Ψ_th(j-top) (K/W)	R_th(j-c) (K/W)	Package name
74AUP1G175GM	Production	0.8 - 3.6	CMOS	± 1.9	7.4	70	ultra low	-40~125	290	6.5	145	XSON6
74AUP1G175GN	Production	0.8 - 3.6	CMOS	± 1.9	7.4	70	ultra low	-40~125	275	11.7	171	XSON6
74AUP1G175GS	Production	0.8 - 3.6	CMOS	± 1.9	7.4	70	ultra low	-40~125	272	14.8	177	XSON6
74AUP1G175GW	Production	0.8 - 3.6	CMOS	± 1.9	7.4	70	ultra low	-40~125	264	38.6	153	TSSOP6

Package

Type number	Package	Package information	Reflow-/Wave soldering	Packing	Status	Marking	Orderable part number, (Ordering code (12NC))
74AUP1G175GM	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_115	Active	aT	74AUP1G175GM,115 ( 9352 800 04115 )
74AUP1G175GM	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_132	Active	aT	74AUP1G175GM,132 ( 9352 800 04132 )
74AUP1G175GN	XSON6 (SOT1115)	SOT1115	REFLOW_BG-BD-1	SOT1115_132	Active	aT	74AUP1G175GN,132 ( 9352 917 28132 )
74AUP1G175GS	XSON6 (SOT1202)	SOT1202	REFLOW_BG-BD-1	SOT1202_132	Active	aT	74AUP1G175GS,132 ( 9352 928 53132 )
74AUP1G175GW	TSSOP6 (SOT363-2)	SOT363-2		SOT363-2_125	Active	aT	74AUP1G175GW,125 ( 9352 800 03125 )

Discontinuation information

Type number	Orderable part number, (Ordering code (12NC))	Last time buy date	Last time delivery date	Replacement product	Status	Comments
74AUP1G175GM	935280004114

Environmental information

Type number	Orderable part number	Chemical content	Leadfree conversion date
74AUP1G175GM	74AUP1G175GM,115	74AUP1G175GM	Always Pb-free
74AUP1G175GM	74AUP1G175GM,132	74AUP1G175GM	Always Pb-free
74AUP1G175GN	74AUP1G175GN,132	74AUP1G175GN	Always Pb-free
74AUP1G175GS	74AUP1G175GS,132	74AUP1G175GS	Always Pb-free
74AUP1G175GW	74AUP1G175GW,125	74AUP1G175GW	Always Pb-free

Quality and reliability disclaimer

Documentation (16)

File name	Title	Type	Date
74AUP1G175	Low-power D-type flip-flop with reset; positive-edge trigger	Data sheet	2023-07-13
AN10161	PicoGate Logic footprints	Application note	2002-10-29
AN11052	Pin FMEA for AUP family	Application note	2019-01-09
aup1g175	aup1g175 IBIS model	IBIS model	2014-12-21
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Leaflet	2019-04-12
Nexperia_Selection_guide_2023	Nexperia Selection Guide 2023	Selection guide	2023-05-10
MAR_SOT1202	MAR_SOT1202 Topmark	Top marking	2013-06-03
SOT1202	plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body	Package information	2022-06-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
SOT363-2	plastic thin shrink small outline package; 6 leads; body width 1.25 mm	Package information	2022-11-21
MAR_SOT1115	MAR_SOT1115 Topmark	Top marking	2013-06-03
SOT1115	plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body	Package information	2022-05-27
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
MAR_SOT886	MAR_SOT886 Topmark	Top marking	2013-06-03
SOT886	plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Package information	2022-06-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06

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Models

File name	Title	Type	Date
aup1g175	aup1g175 IBIS model	IBIS model	2014-12-21

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