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74LVC1G157

Single 2-input multiplexer

The 74LVC1G157 is a single 2-input multiplexer. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 1.65 V to 5.5 V

  • High noise immunity

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power dissipation

  • Direct interface with TTL levels

  • Overvoltage tolerant inputs to 5.5 V

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 250 mA

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

Parametrics

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74LVC1G157GMProduction1.65 - 5.5CMOS/LVTTL± 322.2low-40~1253077.5155XSON6
74LVC1G157GNProduction1.65 - 5.5CMOS/LVTTL± 322.2low-40~12532220.4199XSON6
74LVC1G157GSProduction1.65 - 5.5CMOS/LVTTL± 322.2low-40~12531125.9207XSON6
74LVC1G157GVProduction1.65 - 5.5CMOS/LVTTL± 322.2low-40~12524953.8162TSOP6
74LVC1G157GWProduction1.65 - 5.5CMOS/LVTTL± 322.2low-40~12527649.4164TSSOP6

Package

Type numberPackagePackage informationReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
74LVC1G157GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveYP74LVC1G157GM,132
( 9352 783 12132 )
SOT886_115ActiveYP74LVC1G157GM,115
( 9352 783 12115 )
74LVC1G157GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveYP74LVC1G157GN,132
( 9352 917 78132 )
74LVC1G157GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveYP74LVC1G157GS,132
( 9352 929 04132 )
74LVC1G157GV
TSOP6
(SOT457) 		SOT457REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT457_125ActiveYP74LVC1G157GV,125
( 9352 783 13125 )
74LVC1G157GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125ActiveYP74LVC1G157GW,125
( 9352 783 15125 )

Environmental information

Type numberOrderable part numberChemical contentRoHSRHF-indicatorLeadfree conversion date
74LVC1G157GM74LVC1G157GM,13274LVC1G157GMAlways Pb-free
74LVC1G157GM74LVC1G157GM,11574LVC1G157GMAlways Pb-free
74LVC1G157GN74LVC1G157GN,13274LVC1G157GNAlways Pb-free
74LVC1G157GS74LVC1G157GS,13274LVC1G157GSAlways Pb-free
74LVC1G157GV74LVC1G157GV,12574LVC1G157GVAlways Pb-free
74LVC1G157GW74LVC1G157GW,12574LVC1G157GWAlways Pb-free
Quality and reliability disclaimer

Documentation (19)

File nameTitleTypeDate
74LVC1G157Single 2-input multiplexerData sheet2023-08-15
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11009Pin FMEA for LVC familyApplication note2019-01-09
lvc1g15774LVC1G157 IBIS modelIBIS model2014-10-20
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT457MAR_SOT457 TopmarkTop marking2013-06-03
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT457plastic, surface-mounted package (SC-74; TSOP6); 6 leadsPackage information2023-03-03
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

Support

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Models

File nameTitleTypeDate
lvc1g15774LVC1G157 IBIS modelIBIS model2014-10-20

Ordering, pricing & availability

Sample

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