74AUP2G241

Low-power dual buffer/line driver; 3-state

The 74AUP2G241 provides a dual non-inverting buffer/line driver with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH level at pin 1OE causes output 1Y to assume a high-impedance OFF-state. A LOW level at pin 2OE causes output 2Y to assume a high-impedance OFF-state.

Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire V_CC range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire V_CC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using I_OFF. The I_OFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

This device has an input-disable feature, which allows floating input signals. The input 1A is disabled when the output enable input 1OE is HIGH. The input 2A is disabled when the output enable input 2OE is LOW.

Features and benefits

Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
Complies with JEDEC standards:
- JESD8-12 (0.8 V to 1.3 V)
- JESD8-11 (0.9 V to 1.65 V)
- JESD8-7 (1.2 V to 1.95 V)
- JESD8-5 (1.8 V to 2.7 V)
- JESD8-B (2.7 V to 3.6 V)
Low static power consumption; I_CC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of V_CC
Input-disable feature allows floating input conditions
I_OFF circuitry provides partial Power-down mode operation
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C

Parametrics

Type number	Product status	V_CC (V)	Logic switching levels	Output drive capability (mA)	f_max (MHz)	Nr of bits	Power dissipation considerations	T_amb (°C)	R_th(j-a) (K/W)	R_th(j-c) (K/W)	Package name
74AUP2G241DC	Production	0.8 - 3.6	CMOS	± 1.9	70	2	ultra low	-40~125	203	113	VSSOP8
74AUP2G241GN	Production	0.8 - 3.6	CMOS	± 1.9	70	2	ultra low	-40~125	238	148	XSON8
74AUP2G241GS	Production	0.8 - 3.6	CMOS	± 1.9	70	2	ultra low	-40~125	276	146	XSON8
74AUP2G241GT	Production	0.8 - 3.6	CMOS	± 1.9	70	2	ultra low	-40~125	327	157	XSON8

Package

Type number	Package	Package information	Reflow-/Wave soldering	Packing	Status	Marking	Orderable part number, (Ordering code (12NC))
74AUP2G241DC	VSSOP8 (SOT765-1)	SOT765-1		SOT765-1_125	Active	p41	74AUP2G241DC,125 ( 9352 807 38125 )
74AUP2G241GN	XSON8 (SOT1116)	SOT1116	REFLOW_BG-BD-1	SOT1116_115	Active	p1	74AUP2G241GN,115 ( 9352 922 25115 )
74AUP2G241GS	XSON8 (SOT1203)	SOT1203	REFLOW_BG-BD-1	SOT1203_115	Active	p1	74AUP2G241GS,115 ( 9352 927 85115 )
74AUP2G241GT	XSON8 (SOT833-1)	SOT833-1		SOT833-1_115	Active	p41	74AUP2G241GT,115 ( 9352 807 39115 )

Environmental information

Type number	Orderable part number	Chemical content	Leadfree conversion date
74AUP2G241DC	74AUP2G241DC,125	74AUP2G241DC	Always Pb-free
74AUP2G241GN	74AUP2G241GN,115	74AUP2G241GN	Always Pb-free
74AUP2G241GS	74AUP2G241GS,115	74AUP2G241GS	Always Pb-free
74AUP2G241GT	74AUP2G241GT,115	74AUP2G241GT	Always Pb-free

Quality and reliability disclaimer

Documentation (15)

File name	Title	Type	Date
74AUP2G241	Low-power dual buffer/line driver; 3-state	Data sheet	2023-07-27
AN10161	PicoGate Logic footprints	Application note	2002-10-29
AN11052	Pin FMEA for AUP family	Application note	2019-01-09
aup2g241	aup2g241 IBIS model	IBIS model	2013-04-07
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Leaflet	2019-04-12
Nexperia_Selection_guide_2023	Nexperia Selection Guide 2023	Selection guide	2023-05-10
MAR_SOT1203	MAR_SOT1203 Topmark	Top marking	2013-06-03
SOT1203	plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body	Package information	2022-06-03
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
MAR_SOT833	MAR_SOT833 Topmark	Top marking	2013-06-03
SOT833-1	plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body	Package information	2022-06-03
SOT765-1	plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body	Package information	2022-06-03
MAR_SOT1116	MAR_SOT1116 Topmark	Top marking	2013-06-03
SOT1116	plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body	Package information	2022-06-02
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06

Support

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Models

File name	Title	Type	Date
aup2g241	aup2g241 IBIS model	IBIS model	2013-04-07

Ordering, pricing & availability

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