74AUP1G04

Low-power inverter

The 74AUP1G04 is a single inverter.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire V_CC range from 0.8 V to 3.6 V.

This device is fully specified for partial Power-down applications using I_OFF. The I_OFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

Features and benefits

Wide supply voltage range from 0.8 V to 3.6 V
CMOS low power dissipation
High noise immunity
Complies with JEDEC standards:
- JESD8-12 (0.8 V to 1.3 V)
- JESD8-11 (0.9 V to 1.65 V)
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
Low static power consumption; I_CC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78B Class II
Overvoltage tolerant inputs to 3.6 V
Low noise overshoot and undershoot < 10 % of V_CC
I_OFF circuitry provides partial Power-down mode operation
Multiple package options
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C and -40 °C to +125 °C

Parametrics

Type number	Product status	V_CC (V)	Logic switching levels	Output drive capability (mA)	f_max (MHz)	Nr of bits	Power dissipation considerations	T_amb (°C)	R_th(j-a) (K/W)	R_th(j-c) (K/W)	Package name
74AUP1G04GM	Production	0.8 - 3.6	CMOS	± 1.9	70	1	ultra low	-40~125	311	157	XSON6
74AUP1G04GN	Production	0.8 - 3.6	CMOS	± 1.9	70	1	ultra low	-40~125	334	207	XSON6
74AUP1G04GS	Production	0.8 - 3.6	CMOS	± 1.9	70	1	ultra low	-40~125	321	215	XSON6
74AUP1G04GV	Production	0.8 - 3.6	CMOS	± 1.9	70	1	ultra low	-40~125	268	167	TSOP5
74AUP1G04GW	Production	0.8 - 3.6	CMOS	± 1.9	70	1	ultra low	-40~125	309	179	TSSOP5
74AUP1G04GX	Production	0.8 - 3.6	CMOS	± 1.9	70	1	ultra low	-40~125	322	191	X2SON5
74AUP1G04GX4	Production	0.8 - 3.6	CMOS	± 1.9	70	1	ultra low	-40~125	-	-	X2SON4

Package

Type number	Package	Package information	Reflow-/Wave soldering	Packing	Status	Marking	Orderable part number, (Ordering code (12NC))
74AUP1G04GM	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_132	Active	pC	74AUP1G04GM,132 ( 9352 790 02132 )
74AUP1G04GM	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_115	Active	pC	74AUP1G04GM,115 ( 9352 790 02115 )
74AUP1G04GN	XSON6 (SOT1115)	SOT1115	REFLOW_BG-BD-1	SOT1115_132	Active	pC	74AUP1G04GN,132 ( 9352 917 14132 )
74AUP1G04GS	XSON6 (SOT1202)	SOT1202	REFLOW_BG-BD-1	SOT1202_132	Active	pC	74AUP1G04GS,132 ( 9352 928 27132 )
74AUP1G04GV	TSOP5 (SOT753)	SOT753	REFLOW_BG-BD-1 WAVE_BG-BD-1	SOT753_125	Active	p04	74AUP1G04GV,125 ( 9352 906 76125 )
74AUP1G04GW	TSSOP5 (SOT353-1)	SOT353-1	WAVE_BG-BD-1	SOT353-1_125	Active	pC	74AUP1G04GW,125 ( 9352 790 03125 )
74AUP1G04GX	X2SON5 (SOT1226)	SOT1226	REFLOW_BG-BD-1	SOT1226_125	Active	pC	74AUP1G04GX,125 ( 9352 983 55125 )
74AUP1G04GX4	X2SON4 (SOT1269-2)	SOT1269-2		SOT1269-2_147	Active	pC	74AUP1G04GX4Z ( 9353 401 14147 )

Environmental information

Type number	Orderable part number	Chemical content	Leadfree conversion date
74AUP1G04GM	74AUP1G04GM,132	74AUP1G04GM	Always Pb-free
74AUP1G04GM	74AUP1G04GM,115	74AUP1G04GM	Always Pb-free
74AUP1G04GN	74AUP1G04GN,132	74AUP1G04GN	Always Pb-free
74AUP1G04GS	74AUP1G04GS,132	74AUP1G04GS	Always Pb-free
74AUP1G04GV	74AUP1G04GV,125	74AUP1G04GV	Always Pb-free
74AUP1G04GW	74AUP1G04GW,125	74AUP1G04GW	Always Pb-free
74AUP1G04GX	74AUP1G04GX,125	74AUP1G04GX	Always Pb-free
74AUP1G04GX4	74AUP1G04GX4Z	74AUP1G04GX4	week 25, 2019

Quality and reliability disclaimer

Documentation (26)

File name	Title	Type	Date
74AUP1G04	Low-power inverter	Data sheet	2023-07-11
AN10161	PicoGate Logic footprints	Application note	2002-10-29
AN11052	Pin FMEA for AUP family	Application note	2019-01-09
aup1g04	74AUP1G04 IBIS model	IBIS model	2018-05-25
Nexperia_document_leaflet_Logic_X2SON_packages_062018	X2SON ultra-small 4, 5, 6 & 8-pin leadless packages	Leaflet	2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Leaflet	2019-04-12
Nexperia_Selection_guide_2023	Nexperia Selection Guide 2023	Selection guide	2023-05-10
MAR_SOT1202	MAR_SOT1202 Topmark	Top marking	2013-06-03
SOT1202	plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body	Package information	2022-06-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
WAVE_BG-BD-1	Wave soldering profile	Wave soldering	2021-09-08
SOT353-1	plastic thin shrink small outline package; 5 leads; body width 1.25 mm	Package information	2022-11-15
MAR_SOT1115	MAR_SOT1115 Topmark	Top marking	2013-06-03
SOT1115	plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body	Package information	2022-05-27
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
MAR_SOT1226	MAR_SOT1226 Topmark	Top marking	2013-06-03
SOT1226	plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body	Package information	2022-05-30
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
MAR_SOT886	MAR_SOT886 Topmark	Top marking	2013-06-03
SOT886	plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Package information	2022-06-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
SOT1269-2	plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body	Package information	2020-08-18
MAR_SOT753	MAR_SOT753 Topmark	Top marking	2013-06-03
SOT753	plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body	Package information	2022-05-31
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
WAVE_BG-BD-1	Wave soldering profile	Wave soldering	2021-09-08

Support

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Models

File name	Title	Type	Date
aup1g04	74AUP1G04 IBIS model	IBIS model	2018-05-25

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