74AUP1G374

Low-power D-type flip-flop; positive-edge trigger; 3-state

The 74AUP1G374 is a single D-type flip-flop; positive-edge trigger (3-state). Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire V_CC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using I_OFF. The I_OFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
CMOS low power dissipation
Complies with JEDEC standards:
- JESD8-12 (0.8 V to 1.3 V)
- JESD8-11 (0.9 V to 1.65 V)
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
Low static power consumption; I_CC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Overvoltage tolerant inputs to 3.6 V
Low noise overshoot and undershoot < 10 % of V_CC
I_OFF circuitry provides partial Power-down mode operation
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C

Parametrics

Type number	Product status	V_CC (V)	Logic switching levels	Output drive capability (mA)	t_pd (ns)	f_max (MHz)	Power dissipation considerations	T_amb (°C)	R_th(j-a) (K/W)	Ψ_th(j-top) (K/W)	R_th(j-c) (K/W)	Package name
74AUP1G374GM	Production	0.8 - 3.6	CMOS	± 1.9	7.9	400	ultra low	-40~125	290	6.5	145	XSON6
74AUP1G374GN	Production	0.8 - 3.6	CMOS	± 1.9	7.9	400	ultra low	-40~125	275	11.7	171	XSON6
74AUP1G374GS	Production	0.8 - 3.6	CMOS	± 1.9	7.9	400	ultra low	-40~125	272	14.8	177	XSON6
74AUP1G374GW	Production	0.8 - 3.6	CMOS	± 1.9	7.9	400	ultra low	-40~125	264	38.6	153	TSSOP6

Package

Type number	Package	Package information	Reflow-/Wave soldering	Packing	Status	Marking	Orderable part number, (Ordering code (12NC))
74AUP1G374GM	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_132	Active	aX	74AUP1G374GM,132 ( 9352 806 24132 )
74AUP1G374GM	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_115	Active	aX	74AUP1G374GM,115 ( 9352 806 24115 )
74AUP1G374GN	XSON6 (SOT1115)	SOT1115	REFLOW_BG-BD-1	SOT1115_132	Active	aX	74AUP1G374GN,132 ( 9352 917 39132 )
74AUP1G374GS	XSON6 (SOT1202)	SOT1202	REFLOW_BG-BD-1	SOT1202_132	Active	aX	74AUP1G374GS,132 ( 9352 928 64132 )
74AUP1G374GW	TSSOP6 (SOT363-2)	SOT363-2		SOT363-2_125	Active	aX	74AUP1G374GW,125 ( 9352 806 23125 )

Environmental information

Type number	Orderable part number	Chemical content	Leadfree conversion date
74AUP1G374GM	74AUP1G374GM,132	74AUP1G374GM	Always Pb-free
74AUP1G374GM	74AUP1G374GM,115	74AUP1G374GM	Always Pb-free
74AUP1G374GN	74AUP1G374GN,132	74AUP1G374GN	Always Pb-free
74AUP1G374GS	74AUP1G374GS,132	74AUP1G374GS	Always Pb-free
74AUP1G374GW	74AUP1G374GW,125	74AUP1G374GW	Always Pb-free

Quality and reliability disclaimer

Documentation (16)

File name	Title	Type	Date
74AUP1G374	Low-power D-type flip-flop; positive-edge trigger; 3-state	Data sheet	2023-07-14
AN10161	PicoGate Logic footprints	Application note	2002-10-29
AN11052	Pin FMEA for AUP family	Application note	2019-01-09
aup1g374	aup1g374 IBIS model	IBIS model	2014-12-21
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Leaflet	2019-04-12
Nexperia_Selection_guide_2023	Nexperia Selection Guide 2023	Selection guide	2023-05-10
MAR_SOT1202	MAR_SOT1202 Topmark	Top marking	2013-06-03
SOT1202	plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body	Package information	2022-06-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
SOT363-2	plastic thin shrink small outline package; 6 leads; body width 1.25 mm	Package information	2022-11-21
MAR_SOT1115	MAR_SOT1115 Topmark	Top marking	2013-06-03
SOT1115	plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body	Package information	2022-05-27
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
MAR_SOT886	MAR_SOT886 Topmark	Top marking	2013-06-03
SOT886	plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Package information	2022-06-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06

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Models

File name	Title	Type	Date
aup1g374	aup1g374 IBIS model	IBIS model	2014-12-21

Ordering, pricing & availability

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