
NEVB-LOGIC01 footprint adapter board
NEVB-LOGIC01 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
Packages on the board (7)
Package | Package name | Package information | Package description | Reference | Date |
---|---|---|---|---|---|
![]() TSSOP14 (SOT402-1) |
TSSOP14 | SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2023-10-27 |
![]() TSSOP20 (SOT360-1) |
TSSOP20 | SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2003-02-07 |
![]() TSSOP24 (SOT355-1) |
TSSOP24 | SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2024-11-07 |
![]() DHVQFN16 (SOT763-1) |
DHVQFN16 | SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | MO-241 (JEDEC) | 2003-01-27 |
![]() DHVQFN20 (SOT764-1) |
DHVQFN20 | SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | MO-241 (JEDEC) | 2014-12-12 |
![]() DHVQFN24 (SOT815-1) |
DHVQFN24 | SOT815-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 5.5 mm x 3.5 mm x 1 mm body | 2003-04-29 | |
![]() XQFN12 (SOT1174-1) |
XQFN12 | SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | MO-288 (JEDEC) | 2010-04-21 |
Related boards (3)
Board | Description | Type | Quick links | Shop link | |
---|---|---|---|---|---|
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nevb-logic02-footprint-adapter-board | NEVB-LOGIC02 footprint adapter board | Evaluation board | ||
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nevb-logic03-footprint-adapter-board | NEVB-LOGIC03 footprint adapter board | Evaluation board | ||
![]() |
nevb-logic04-footprint-adapter-board | Logic footprint adapter board (NEVB-LOGIC04) | Evaluation board |
Packages on the board (7)
Package | Package name | Package information | Package description | Reference | Date |
---|---|---|---|---|---|
![]() TSSOP14 (SOT402-1) |
TSSOP14 | SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2023-10-27 |
![]() TSSOP20 (SOT360-1) |
TSSOP20 | SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2003-02-07 |
![]() TSSOP24 (SOT355-1) |
TSSOP24 | SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2024-11-07 |
![]() DHVQFN16 (SOT763-1) |
DHVQFN16 | SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | MO-241 (JEDEC) | 2003-01-27 |
![]() DHVQFN20 (SOT764-1) |
DHVQFN20 | SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | MO-241 (JEDEC) | 2014-12-12 |
![]() DHVQFN24 (SOT815-1) |
DHVQFN24 | SOT815-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 5.5 mm x 3.5 mm x 1 mm body | 2003-04-29 | |
![]() XQFN12 (SOT1174-1) |
XQFN12 | SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | MO-288 (JEDEC) | 2010-04-21 |
Related boards (3)
Board | Description | Type | Quick links | Shop link | |
---|---|---|---|---|---|
![]() |
nevb-logic02-footprint-adapter-board | NEVB-LOGIC02 footprint adapter board | Evaluation board | ||
![]() |
nevb-logic03-footprint-adapter-board | NEVB-LOGIC03 footprint adapter board | Evaluation board | ||
![]() |
nevb-logic04-footprint-adapter-board | Logic footprint adapter board (NEVB-LOGIC04) | Evaluation board |
Documentation (1)
File name | Title | Type | Date |
---|---|---|---|
nexperia_factsheet_dual_in_line_logic_footprint_adapter_boards | Dual in-line Logic footprint adapter boards | Leaflet | 2024-01-24 |
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