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PSMN6R9-100YSF

NextPower 100 V, 7 mΩ N-channel MOSFET in LFPAK56 package

NextPower 100 V standard level gate drive MOSFET. Qualified to 175 °C and recommended for industrial & consumer applications.

This product has been discontinued, click here for discontinuation information and replacement parts.

Features and benefits

  • Low Qrr for higher efficiency and lower spiking

  • Qualified to 175 °C

  • Low QG x RDSon FOM for high efficiency switching applications

  • Strong avalanche energy rating (Eas)

  • Avalanche rated and 100% tested

  • Ha-free and RoHS compliant LFPAK56 package

  • Wave-solderable LFPAK56 package

Applications

  • Synchronous rectifier in AC-DC and DC-DC

  • BLDC motor control

  • USB-PD and mobile fast-charge adapters

  • LED lighting

  • Full-bridge and half-bridge applications

  • Flyback and resonant topologies

Parametrics

Type number Package version Package name Product status Channel type Nr of transistors VDS [max] (V) RDSon [max] @ VGS = 10 V (mΩ) Tj [max] (°C) ID [max] (A) QGD [typ] (nC) QG(tot) [typ] @ VGS = 10 V (nC) Ptot [max] (W) Qr [typ] (nC) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
PSMN6R9-100YSF SOT669 LFPAK56; Power-SO8 End of life N 1 100 7 175 90 10.3 50.3 238 52.4 3.3 N 3570 722 2017-03-24

Package

All type numbers in the table below are discontinued. See the table Discontinuation information for more information.

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
PSMN6R9-100YSF PSMN6R9-100YSFX
(934071219115)
Discontinued / End-of-life 6F9S10 SOT669
LFPAK56; Power-SO8
(SOT669)
SOT669 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT669_115

Environmental information

All type numbers in the table below are discontinued. See the table Discontinuation information for more information.

Type number Orderable part number Chemical content RoHS RHF-indicator
PSMN6R9-100YSF PSMN6R9-100YSFX PSMN6R9-100YSF rohs rhf
Quality and reliability disclaimer

Documentation (23)

File name Title Type Date
PSMN6R9-100YSF NextPower 100 V, 7 mΩ N-channel MOSFET in LFPAK56 package Data sheet 2018-03-13
AN10273 Power MOSFET single-shot and repetitive avalanche ruggedness rating Application note 2022-06-20
AN11156 Using Power MOSFET Zth Curves Application note 2021-01-04
AN11158 Understanding power MOSFET data sheet parameters Application note 2020-07-06
AN11160 Designing RC Snubbers Application note 2023-02-03
AN11243 Failure signature of Electrical Overstress on Power MOSFETs Application note 2017-12-21
AN11261 RC Thermal Models Application note 2021-03-18
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
AN90001 Designing in MOSFETs for safe and reliable gate-drive operation Application note 2017-05-05
AN90003 LFPAK MOSFET thermal design guide Application note 2023-08-22
SOT669 3D model for products with SOT669 package Design support 2017-06-30
SOT669 3D model for products with SOT669 package Design support 2017-06-30
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
LFPAK56_POWER-SO8_SOT669_mk plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body Marcom graphics 2017-01-28
SOT669 plastic, single-ended surface-mounted package; 4 terminals Package information 2022-05-30
Reliability_information_t8_sot669 Reliability qualification information Quality document 2022-09-16
T8_SOT669_PSMN6R9-100YSF_Nexperia_Quality_document PSMN6R9-100YSF Quality document Quality document 2022-09-16
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
PSMN6R9-100YSF PSMN6R9-100YSF SPICE model SPICE model 2017-10-06
TN00008 Power MOSFET frequently asked questions and answers Technical note 2023-01-12
PSMN6R9-100YSF_RCthermal PSMN6R9-100YSF Thermal design Thermal design 2017-10-06
PSMN6R9-100YSF PSMN6R9-100YSF Thermal model Thermal model 2017-10-06
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

Support

If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.

Models

File name Title Type Date
SOT669 3D model for products with SOT669 package Design support 2017-06-30
PSMN6R9-100YSF PSMN6R9-100YSF SPICE model SPICE model 2017-10-06
PSMN6R9-100YSF_RCthermal PSMN6R9-100YSF Thermal design Thermal design 2017-10-06
PSMN6R9-100YSF PSMN6R9-100YSF Thermal model Thermal model 2017-10-06
SOT669 3D model for products with SOT669 package Design support 2017-06-30

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.