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We are pleased to invite you for to Nexperia’s Webinar Package Technology for Electronic Design Engineers, that will be held online on November 10th and 11th, 2021.

After registering, you will receive a confirmation email containing information about joining the webinar. Mind that number of seats in the sessions is limited.

 

The training portal will be open as of 9.45 am CET / 4.45 pm CET, please sign in before the training starts.

Webinars will run via GoToWebinar conferencing system. If you were not using it earlier, we recommend you to plan at least 5 mins extra for plug-in/app installation at your device.

How to increase power density and reliability while reduce size and parasitics using CFP and DFN packages? This will be the central question which will be discussed during the 1 hour webinar. The webinar will consist of three parts.
The first part is going to highlight thermal performance of clip-bonded Clip Flat Power packages (CFP) using thermal measurements results.
The second part will demonstrate the benefits of Discretes Flat No-Leads packages (DFN) compared to standard leaded SMD packages.
The third part will explain reliability profile ‘tested beyond AECQ-101’ and what is behind Board Level Reliability testing.

Presenters:

  • Dr-ing Reza Behtash, Application Marketing Manager for Rectifiers, Nexperia, received his diploma degree in electrical engineering in 1999 from the technical University of Hamburg. He then spent four years as a research fellow at DaimlerChrysler research institute in Ulm working on GaN HEMTs and MMICs, and subsequently received his PhD from the Ulm University. Reza continued working on GaN technologies for power amplifiers while at the Ferdinand-Braun-Institut für Hochfrequenztechnik in Berlin and during his time at United Monolithic Semiconductors (UMS).After joining the development team at Nexperia, for the past three years, as part of the Application Marketing team of Nexperia in Hamburg, his main focus has been on discrete planar and Trench Schottky rectifiers in automotive applications.
  • Mr. Nima Lotfi, Application Marketing Manager, Nexperia, received his M.Sc. degree in electrical engineering in 2017 from the Hamburg University of Technology. He joined Nexperia in 2018 and is currently working as an Application Marketing Manager. He is responsible for in-application verification and hardware demonstrators from bipolar discretes, small signal MOFETs towards Analog and Logic IC’s.
  • Mr. Olaf Vogt, Head of Application Marketing, Nexperia, has more than 25 years of experience in the semiconductor industry, holding several technical positions in Marketing and Sales. He received his diploma degree in electrical engineering in 1994 from the Technical University of Hamburg. Today Olaf is leading Nexperia’s Global Application Marketing Team. One of his key goals is to share technical and application insights, “from engineer to engineer”.

Agenda

Clip-bonded Flat Power packges (CFP)

  • CFPx packages as replacement for bulky SMx packages
  • Thermal performance demonstration

 

Discrete Flat No-Lead (DFN) packages

  • Thermal improvement of DFN over leaded SMD packages
  • Impact on parasitic inductance demonstrated using S-parameteres
  • Space saving
  • Easy Automated Optical Inspection trough Side Wettable Flanks

 

Reliability

  • Testing beyond AEC-Q101 – What does that mean?
  • Board level reliability