We are pleased to invite you for to Nexperia’s Webinar Package Technology for Electronic Design Engineers, that will be held online on November 10th and 11th, 2021.
After registering, you will receive a confirmation email containing information about joining the webinar. Mind that number of seats in the sessions is limited.
The training portal will be open as of 9.45 am CET / 4.45 pm CET, please sign in before the training starts.
Webinars will run via GoToWebinar conferencing system. If you were not using it earlier, we recommend you to plan at least 5 mins extra for plug-in/app installation at your device.
How to increase power density and reliability while reduce size and parasitics using CFP and DFN packages? This will be the central question which will be discussed during the 1 hour webinar. The webinar will consist of three parts.
The first part is going to highlight thermal performance of clip-bonded Clip Flat Power packages (CFP) using thermal measurements results.
The second part will demonstrate the benefits of Discretes Flat No-Leads packages (DFN) compared to standard leaded SMD packages.
The third part will explain reliability profile ‘tested beyond AECQ-101’ and what is behind Board Level Reliability testing.
Clip-bonded Flat Power packges (CFP)
Discrete Flat No-Lead (DFN) packages