One of the clearest trends in automotive is the electrification of the powertrain. In turn that is driving innovation in chassis, safety, lighting, body electronics and infotainment systems. As a key supplier to the automotive industry discover our innovation capability with expertise across MOSFETs, GaN FETs and SiGe rectifiers, as well as ESD protection and Analog and Logic.
Automotive H-bridge DC motor control reference design using Nexperia components
The compact package standard with side-wettable flanks for small and light automotive diodes and transistors.
Silicon Germanium rectifiers combine the high efficiency of Schottky rectifiers with the thermal stability of fast recovery diodes. We discuss the novel diode technology and its technical advantages. Also, we review results of a 48V/12V-DC-DC high-frequency converter that utilizes these Silicon Germanium rectifiers.
Sophisticated package technology combined with efficient cooling is a prerequisite when moving to high power density design. We review the results of our top side cooling demonstrator that utilizes a CFP60 and the footprint compatible D2PAK. The clip-bond package stays 34°C cooler or dissipates more power. And we will show you why!
In this session we will take a look at the systems that we expect to see coming onto the 48V bus, and dive into the technical details of 48V/12V DCDC application which is at the heart of the system. We will discuss our discrete solutions for this including SiGe rectifier, Schottky diodes and our new Trench 12 80V/100V MOSFET technology
High ESD robustness is key to ensuring the reliable, high performance of automotive applications. The trend toward increasing data payload in vehicles due to electrification and connectivity challenges hardware engineers with ESD robustness decrease. In addition, new protocols such as CAN-FD or OPEN Alliance Ethernet accelerate this trend.
To ensure performance and reliability at high data rates, Nexperia offers solutions to raise the system-level ESD robustness up to 30 kV.
The video focusses on ESD protection of common Automotive and Consumer data networks and buses, including the latest technology for Automotive Ethernet 100 and 1000BaseT1.
Nexperia pioneered the copper-clip SMD power package almost two decades ago. With years of experience, shipping billions of high-reliability products into the automotive industry, what makes this package so unique? And how have we taken that experience and applied it to an extended package family offering?
Taking an engineers look at the operation, simplicity of circuit implementation, thermal benefits and board level reliability when using P-Channel LFPAK56 devices in an Automotive Application.