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Chemical content 74ALVC00BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74ALVC00BQ-Q100SOT762-1DHVQFN1418.23488 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353039881156126030 s123520 s3Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000231.000000.00128
FillerSilver (Ag)7440-22-40.0174475.000000.09567
PolymerAcrylic resinProprietary0.001406.000000.00765
Resin systemProprietary0.0041918.000000.02296
subTotal0.02326100.000000.12756
DieDoped siliconSilicon (Si)7440-21-30.43058100.000002.36132
subTotal0.43058100.000002.36132
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8028397.4700037.30669
Iron (Fe)7439-89-60.167512.400000.91860
Phosphorus (P)7723-14-00.002090.030000.01148
Zinc (Zn)7440-66-60.006980.100000.03828
subTotal6.97941100.0000038.27505
Mould CompoundAdditiveNon hazardousProprietary0.313922.984001.72152
FillerSilica -amorphous-7631-86-90.367153.490002.01344
Silica fused60676-86-08.9230784.8200048.93409
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.105411.002000.57807
PigmentCarbon black1333-86-40.017250.164000.09461
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.389353.701002.13517
Epoxy resin systemProprietary0.166851.586000.91499
Phenolic resinProprietary0.237022.253001.29979
subTotal10.52001100.0000057.69168
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00972
Nickel (Ni)7440-02-00.1612391.000000.88421
Palladium (Pd)7440-05-30.014178.000000.07773
subTotal0.17718100.000000.97166
WirePure metalGold (Au)7440-57-50.1033999.000000.56700
Palladium (Pd)7440-05-30.001041.000000.00573
subTotal0.10444100.000000.57273
total18.23488100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.