Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC245BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC245BQSOT764-1DHVQFN2028.164984 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93527864511516126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0008531.0000000.003028
FillerSilver (Ag)7440-22-40.06396075.0000000.227090
PolymerAcrylic resinProprietary0.0051176.0000000.018167
Resin systemProprietary0.01535018.0000000.054502
subTotal0.085280100.0000000.302787
DieDoped siliconSilicon (Si)7440-21-30.480912100.0000001.707482
subTotal0.480912100.0000001.707482
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.58916097.47000037.596898
Iron (Fe)7439-89-60.2607362.4000000.925747
Phosphorus (P)7723-14-00.0032590.0300000.011572
Zinc (Zn)7440-66-60.0108640.1000000.038573
subTotal10.864020100.00000038.572790
Mould CompoundAdditiveNon hazardousProprietary0.4886272.9840001.734875
FillerSilica -amorphous-7631-86-90.5714843.4900002.029060
Silica fused60676-86-013.88919984.82000049.313710
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.582555
PigmentCarbon black1333-86-40.0268550.1640000.095348
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060353.7010002.151734
Epoxy resin systemProprietary0.2597061.5860000.922088
Phenolic resinProprietary0.3689272.2530001.309877
subTotal16.374910100.00000058.139248
Pre-PlatingPure metal layerGold (Au)7440-57-50.0027581.0000000.009791
Nickel (Ni)7440-02-00.25095191.0000000.891002
Palladium (Pd)7440-05-30.0220628.0000000.078330
subTotal0.275770100.0000000.979124
WirePure metalCopper (Cu)7440-50-80.08119196.5500000.288270
Pure metal layerGold (Au)7440-57-50.0002940.3500000.001045
Palladium (Pd)7440-05-30.0026073.1000000.009256
subTotal0.084092100.0000000.298571
total28.164984100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.