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Chemical content 74HCT4020BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT4020BQ-Q100SOT763-1DHVQFN1622.07093 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353020971156126030 s123520 s3Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00452
FillerSilver (Ag)7440-22-40.0747675.000000.33873
PolymerAcrylic resinProprietary0.005986.000000.02710
Resin systemProprietary0.0179418.000000.08129
subTotal0.09968100.000000.45164
DieDoped siliconSilicon (Si)7440-21-30.75442100.000003.41816
subTotal0.75442100.000003.41816
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.13202
Iron (Fe)7439-89-60.196362.400000.88968
Phosphorus (P)7723-14-00.002450.030000.01112
Zinc (Zn)7440-66-60.008180.100000.03707
subTotal8.18167100.0000037.06989
Mould CompoundAdditiveNon hazardousProprietary0.371162.984001.68169
FillerSilica -amorphous-7631-86-90.434103.490001.96685
Silica fused60676-86-010.5503184.8200047.80184
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.124631.002000.56470
PigmentCarbon black1333-86-40.020400.164000.09243
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.460353.701002.08577
Epoxy resin systemProprietary0.197271.586000.89382
Phenolic resinProprietary0.280242.253001.26972
subTotal12.43847100.0000056.35682
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07415
Nickel (Ni)7440-02-00.5035192.300002.28131
Palladium (Pd)7440-05-30.016913.100000.07662
Silver (Ag)7440-22-40.008731.600000.03955
subTotal0.54551100.000002.47163
WirePure metalCopper (Cu)7440-50-80.0494296.550000.22391
Pure metal layerGold (Au)7440-57-50.000180.350000.00081
Palladium (Pd)7440-05-30.001593.100000.00719
subTotal0.05118100.000000.23191
total22.07093100.00000100.00000
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