Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP2G132GF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP2G132GFSOT1089XSON81.792900 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352914771158126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.101355100.0000005.653132
subTotal0.101355100.0000005.653132
ComponentAdditiveNon hazardousProprietary0.0010005.0000000.055776
FillerAluminium Trioxide (Al2O3)1344-28-10.00800040.0000000.446204
PolymerBisphenol A-epichlorohydrin resin25068-38-60.00200010.0000000.111551
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.00300015.0000000.167327
Resin systemProprietary0.00600030.0000000.334653
subTotal0.020000100.0000001.115511
Lead FrameCopper alloyCopper (Cu)7440-50-80.63723795.11000035.542250
Magnesium (Mg)7439-95-40.0013400.2000000.074739
Nickel (Ni)7440-02-00.0212393.1700001.184617
Silicon (Si)7440-21-30.0046230.6900000.257850
Pure metal layerGold (Au)7440-57-50.0001340.0200000.007474
Nickel (Ni)7440-02-00.0049580.7400000.276535
Palladium (Pd)7440-05-30.0004690.0700000.026159
subTotal0.670000100.00000037.369625
Mould CompoundFillerSilica -amorphous-7631-86-90.21620023.00000012.058676
Silica fused60676-86-00.56400060.00000031.457415
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0282003.0000001.572871
Ion trapping agentBismuth (Bi)7440-69-90.0047000.5000000.262145
PigmentCarbon black1333-86-40.0047000.5000000.262145
PolymerEpoxy resin systemProprietary0.0658007.0000003.670032
Phenolic resinProprietary0.0564006.0000003.145742
subTotal0.940000100.00000052.429026
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000010.0030000.000050
Bismuth (Bi)7440-69-90.0000000.0010000.000017
Copper (Cu)7440-50-80.0000000.0010000.000017
Lead (Pb)7439-92-10.0000020.0050000.000084
Tin solderTin (Sn)7440-31-50.02999799.9900001.673099
subTotal0.030000100.0000001.673267
WireGold alloyGold (Au)7440-57-50.03123099.0000001.741846
Palladium (Pd)7440-05-30.0003151.0000000.017594
subTotal0.031545100.0000001.759440
total1.792900100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.