×

Chemical content 74AVC4TD245BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AVC4TD245BQ-Q100SOT763-1DHVQFN1621.38171 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691579115212601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.37342
PolymerResin systemProprietary0.0198419.900000.09277
subTotal0.09968100.000000.46619
DieDoped siliconSilicon (Si)7440-21-30.30924100.000001.44627
subTotal0.30924100.000001.44627
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0434197.4700037.61818
Iron (Fe)7439-89-60.198052.400000.92627
Phosphorus (P)7723-14-00.002480.030000.01158
Zinc (Zn)7440-66-60.008250.100000.03859
subTotal8.25219100.0000038.59462
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.69285
FillerSilica -amorphous-7631-86-90.434103.490002.03025
Silica fused60676-86-010.5503184.8200049.34269
PigmentCarbon black1333-86-40.019900.160000.09308
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62827
Epoxy resin systemProprietary0.197771.590000.92496
Phenolic resinProprietary0.279872.250001.30890
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.15242
subTotal12.43847100.0000058.17342
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00980
Nickel (Ni)7440-02-00.1906491.000000.89158
Palladium (Pd)7440-05-30.016768.000000.07838
subTotal0.20949100.000000.97976
WirePure metalCopper (Cu)7440-50-80.0701496.550000.32804
Pure metal layerGold (Au)7440-57-50.000250.350000.00119
Palladium (Pd)7440-05-30.002253.100000.01053
subTotal0.07265100.000000.33976
total21.38171100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.