×

Chemical content 74HC151BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC151BQSOT763-1DHVQFN1621.41846 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691274115312601235Bangkok, Thailand; Suzhou, China; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.37278
PolymerResin systemProprietary0.0198419.900000.09261
subTotal0.09968100.000000.46539
DieDoped siliconSilicon (Si)7440-21-30.35981100.000001.67991
subTotal0.35981100.000001.67991
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.55441
Iron (Fe)7439-89-60.198062.400000.92470
Phosphorus (P)7723-14-00.002480.030000.01156
Zinc (Zn)7440-66-60.008250.100000.03853
subTotal8.25236100.0000038.52920
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.68994
FillerSilica -amorphous-7631-86-90.434103.490002.02677
Silica fused60676-86-010.5503084.8200049.25798
PigmentCarbon black1333-86-40.019900.160000.09292
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62719
Epoxy resin systemProprietary0.197771.590000.92337
Phenolic resinProprietary0.279872.250001.30665
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.14872
subTotal12.43846100.0000058.07354
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00978
Nickel (Ni)7440-02-00.1906391.000000.89001
Palladium (Pd)7440-05-30.016768.000000.07824
subTotal0.20948100.000000.97803
WirePure metalCopper (Cu)7440-50-80.0566596.550000.26448
Pure metal layerGold (Au)7440-57-50.000210.350000.00096
Palladium (Pd)7440-05-30.001823.100000.00849
subTotal0.05867100.000000.27393
total21.41846100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.