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Chemical content 74HCT74BZ

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Type numberPackagePackage descriptionTotal product weight
74HCT74BZSOT8014-1DHXQFN145.56437 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691426147312601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0067160.000000.12055
ImpurityNon hazardousProprietary0.000000.039500.00008
PolymerResin systemProprietary0.0044739.951410.08027
subTotal0.01118100.000000.20090
DieDoped siliconSilicon (Si)7440-21-30.09568100.000001.71943
subTotal0.09568100.000001.71943
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.6945097.0000048.42426
Nickel (Ni)7440-02-00.083343.000001.49766
subTotal2.77784100.0000049.92192
Mould CompoundAdditiveNon hazardousProprietary0.076142.900001.36842
FillerSilica fused60676-86-02.3355288.9500041.97285
PigmentCarbon black1333-86-40.003940.150000.07078
PolymerEpoxy resin systemProprietary0.038601.470000.69365
Phenolic resinProprietary0.081663.110001.46752
Tetramethylbiphenyl diglycidyl ether85954-11-60.089803.420001.61380
subTotal2.62566100.0000047.18702
Pre-PlatingPure metal layerGold (Au)7440-57-50.000141.000000.00247
Nickel (Ni)7440-02-00.0124991.000000.22438
Palladium (Pd)7440-05-30.001108.000000.01973
subTotal0.01372100.000000.24658
WirePure metalCopper (Cu)7440-50-80.0389096.550000.69913
Pure metal layerGold (Au)7440-57-50.000140.350000.00253
Palladium (Pd)7440-05-30.001253.100000.02245
subTotal0.04029100.000000.72411
total5.56437100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.