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Chemical content 74LVC1G386GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G386GW-Q100SOT363-2SC-885.72099 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691568125312601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.12861
PolymerResin systemProprietary0.0024525.000000.04287
subTotal0.00981100.000000.17148
DieDoped siliconSilicon (Si)7440-21-30.07114100.000001.24345
subTotal0.07114100.000001.24345
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400035.71627
Iron (Fe)7439-89-60.048742.310000.85197
Lead (Pb)7439-92-10.000210.010000.00369
Phosphorus (P)7723-14-00.001480.070000.02582
Zinc (Zn)7440-66-60.002530.120000.04426
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23973
subTotal2.11000100.0000036.88174
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.68398
Silica fused60676-86-02.2159070.5700038.73277
PigmentCarbon black1333-86-40.006280.200000.10977
PolymerEpoxy resin systemProprietary0.291719.290005.09887
Phenolic resinProprietary0.186525.940003.26020
subTotal3.14000100.0000054.88559
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.46677
subTotal0.37000100.000006.46740
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0200499.990000.35030
subTotal0.02004100.000000.35034
total5.72099100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.