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Chemical content BAV99QB

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Type numberPackagePackage descriptionTotal product weight
BAV99QBSOT8015DFN1110D-31.61024 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665881147212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0053276.000000.33039
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0007310.470000.04551
Phenolic resinProprietary0.0009513.530000.05882
subTotal0.00700100.000000.43472
DieDoped siliconSilicon (Si)7440-21-30.02000100.000001.24205
subTotal0.02000100.000001.24205
DieDoped siliconSilicon (Si)7440-21-30.02000100.000001.24205
subTotal0.02000100.000001.24205
Lead FrameCopper alloyCopper (Cu)7440-50-80.7188195.5860044.63973
Magnesium (Mg)7439-95-40.001120.149000.06958
Nickel (Ni)7440-02-00.022422.980901.39211
Silicon (Si)7440-21-30.004860.645900.30164
Pure metal layerGold (Au)7440-57-50.000060.007700.00360
Nickel (Ni)7440-02-00.004470.594000.27740
Palladium (Pd)7440-05-30.000270.036500.01705
subTotal0.75200100.0000046.70111
Mould CompoundFillerSilica -amorphous-7631-86-90.060017.980003.72675
Silica fused60676-86-00.6022980.0920037.40386
PigmentCarbon black1333-86-40.006980.928000.43339
PolymerEpoxy resin systemProprietary0.063548.450003.94624
Phenolic resinProprietary0.019182.550001.19088
subTotal0.75200100.0000046.70112
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000030.055500.00196
Tin solderTin (Sn)7440-31-50.0569799.940003.53772
subTotal0.05700100.000003.53984
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0022499.990000.13935
subTotal0.00224100.000000.13936
total1.61024100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.