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Chemical content NMUX1309BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
NMUX1309BQ-Q100SOT763-1DHVQFN1621.30171 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691416115412601235Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.37482
PolymerResin systemProprietary0.0198419.900000.09312
subTotal0.09968100.000000.46794
DieDoped siliconSilicon (Si)7440-21-30.24311100.000001.14128
subTotal0.24311100.000001.14128
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0434197.4700037.75945
Iron (Fe)7439-89-60.198052.400000.92975
Phosphorus (P)7723-14-00.002480.030000.01162
Zinc (Zn)7440-66-60.008250.100000.03874
subTotal8.25219100.0000038.73956
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.69920
FillerSilica -amorphous-7631-86-90.434103.490002.03788
Silica fused60676-86-010.5503184.8200049.52800
PigmentCarbon black1333-86-40.019900.160000.09343
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.63063
Epoxy resin systemProprietary0.197771.590000.92843
Phenolic resinProprietary0.279872.250001.31382
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.16050
subTotal12.43847100.0000058.39189
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00983
Nickel (Ni)7440-02-00.1906491.000000.89493
Palladium (Pd)7440-05-30.016768.000000.07868
subTotal0.20949100.000000.98344
WirePure metalCopper (Cu)7440-50-80.0567496.550000.26638
Pure metal layerGold (Au)7440-57-50.000210.350000.00097
Palladium (Pd)7440-05-30.001823.100000.00855
subTotal0.05877100.000000.27590
total21.30171100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.