Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NX3008PBK

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NX3008PBKSOT23TO-236AB7.659854 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065642235112601235
934065642215612601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.0010162.5400000.013264
Doped siliconSilicon (Si)7440-21-30.03641291.0300000.475362
Gold alloyGold (Au)7440-57-50.0025726.4300000.033578
subTotal0.040000100.0000000.522203
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.029950
Carbon (C)7440-44-00.0010200.0400000.013311
Chromium (Cr)7440-47-30.0056080.2200000.073210
Cobalt (Co)7440-48-40.0109610.4300000.143093
Iron (Fe)7439-89-61.22301047.98000015.966495
Manganese (Mn)7439-96-50.0219210.8600000.286186
Nickel (Ni)7440-02-00.92120936.14000012.026451
Phosphorus (P)7723-14-00.0005100.0200000.006655
Silicon (Si)7440-21-30.0066270.2600000.086521
Sulphur (S)7704-34-90.0005100.0200000.006655
Pure metal layerCopper (Cu)7440-50-80.28982111.3700003.783640
Silver (Ag)7440-22-40.0655092.5700000.855229
subTotal2.549000100.00000033.277397
Mould CompoundAdditiveNon hazardousProprietary0.1414912.9000001.847176
Triphenylphosphine603-35-00.0024400.0500000.031848
FillerSilica -amorphous-7631-86-93.51288072.00000045.860926
PigmentCarbon black1333-86-40.0024400.0500000.031848
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.73185015.0000009.554360
Phenol Formaldehyde resin (generic)9003-35-40.48790010.0000006.369573
subTotal4.879000100.00000063.695731
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000109
Non hazardousProprietary0.0001030.0555000.001340
Tin solderTin (Sn)7440-31-50.18488999.9400002.413741
subTotal0.185000100.0000002.415190
WirePure metalCopper (Cu)7440-50-80.006854100.0000000.089480
subTotal0.006854100.0000000.089480
total7.659854100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.