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Chemical content PMCPB5530XA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMCPB5530XASOT1118HUSON67.29482 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934667306115212601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01069
FillerSilver (Ag)7440-22-40.0655284.000000.89817
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10693
Isobornyl Methacrylate7534-94-30.003905.000000.05346
subTotal0.07800100.000001.06925
DieDoped siliconSilicon (Si)7440-21-30.15100100.000002.06996
subTotal0.15100100.000002.06996
DieDoped siliconSilicon (Si)7440-21-30.16440100.000002.25372
subTotal0.16440100.000002.25372
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100035.08531
Magnesium (Mg)7439-95-40.005380.200000.07378
Nickel (Ni)7440-02-00.085303.170001.16939
Silicon (Si)7440-21-30.018570.690000.25454
Pure metal layerGold (Au)7440-57-50.000540.020000.00738
Nickel (Ni)7440-02-00.019910.740000.27298
Palladium (Pd)7440-05-30.001880.070000.02582
subTotal2.69100100.0000036.88920
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.25856
Silica fused60676-86-02.3328060.0000031.97886
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.116643.000001.59894
Ion trapping agentBismuth (Bi)7440-69-90.019440.500000.26649
PigmentCarbon black1333-86-40.019440.500000.26649
PolymerEpoxy resin systemProprietary0.272167.000003.73087
Phenolic resinProprietary0.233286.000003.19789
subTotal3.88800100.0000053.29810
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00125
Tin solderTin (Sn)7440-31-50.1639099.940002.24682
subTotal0.16400100.000002.24817
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalGold (Au)7440-57-50.0144099.990000.19738
subTotal0.01440100.000000.19740
WirePure metalGold (Au)7440-57-50.14402100.000001.97428
subTotal0.14402100.000001.97428
total7.29482100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.