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Chemical content PMDPB55XPA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMDPB55XPASOT1118HUSON67.28142 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934667309115212601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01071
FillerSilver (Ag)7440-22-40.0655284.000000.89982
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10712
Isobornyl Methacrylate7534-94-30.003905.000000.05356
subTotal0.07800100.000001.07121
DieDoped siliconSilicon (Si)7440-21-30.30200100.000004.14754
subTotal0.30200100.000004.14754
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100035.14988
Magnesium (Mg)7439-95-40.005380.200000.07391
Nickel (Ni)7440-02-00.085303.170001.17154
Silicon (Si)7440-21-30.018570.690000.25500
Pure metal layerGold (Au)7440-57-50.000540.020000.00739
Nickel (Ni)7440-02-00.019910.740000.27348
Palladium (Pd)7440-05-30.001880.070000.02587
subTotal2.69100100.0000036.95707
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.28112
Silica fused60676-86-02.3328060.0000032.03771
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.116643.000001.60189
Ion trapping agentBismuth (Bi)7440-69-90.019440.500000.26698
PigmentCarbon black1333-86-40.019440.500000.26698
PolymerEpoxy resin systemProprietary0.272167.000003.73773
Phenolic resinProprietary0.233286.000003.20377
subTotal3.88800100.0000053.39618
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00125
Tin solderTin (Sn)7440-31-50.1639099.940002.25096
subTotal0.16400100.000002.25231
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalGold (Au)7440-57-50.0144099.990000.19774
subTotal0.01440100.000000.19776
WirePure metalGold (Au)7440-57-50.14402100.000001.97791
subTotal0.14402100.000001.97791
total7.28142100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.