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Chemical content PMEG10020ELXE

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Type numberPackagePackage descriptionTotal product weight
PMEG10020ELXESOD123HPSOD216.84900 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934666034115312601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Suzhou, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.36900100.000002.19004
subTotal0.36900100.000002.19004
ClipCopper alloyCopper (Cu)7440-50-82.5765999.8680015.29227
Iron (Fe)7439-89-60.002480.096000.01470
Phosphorus (P)7723-14-00.000930.036000.00551
subTotal2.58000100.0000015.31248
Lead FrameCopper alloyCopper (Cu)7440-50-86.8904899.8620040.89547
Iron (Fe)7439-89-60.007110.103000.04218
Phosphorus (P)7723-14-00.002420.035000.01433
subTotal6.90000100.0000040.95198
Mould CompoundFillerSilica -amorphous-7631-86-90.5130010.000003.04469
Silica fused60676-86-03.8475075.0000022.83518
PigmentCarbon black1333-86-40.015390.300000.09134
PolymerEpoxy resin systemProprietary0.395017.700002.34441
Phenolic resinProprietary0.359107.000002.13128
subTotal5.13000100.0000030.44690
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00006
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000020.005000.00010
Tin solderTin (Sn)7440-31-50.3399799.990002.01772
subTotal0.34000100.000002.01792
Solder PasteImpurityAntimony (Sb)7440-36-00.000460.030000.00272
Lead alloyLead (Pb)7439-92-11.4147992.470008.39688
Silver (Ag)7440-22-40.038252.500000.22702
Tin (Sn)7440-31-50.076505.000000.45403
subTotal1.53000100.000009.08065
total16.84900100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.