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Chemical content PMEG10030ELP-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG10030ELP-QSOD128FlatPower37.93000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662879115112601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.03500100.000002.72871
subTotal1.03500100.000002.72871
ClipCopper alloyCopper (Cu)7440-50-86.8411099.8700018.03611
Iron (Fe)7439-89-60.006850.100000.01806
Phosphorus (P)7723-14-00.002060.030000.00542
subTotal6.85000100.0000018.05959
Lead FrameCopper alloyCopper (Cu)7440-50-812.1607399.5150032.06099
Iron (Fe)7439-89-60.011490.094000.03028
Phosphorus (P)7723-14-00.004280.035000.01128
Pure metal layerCopper (Cu)7440-50-80.001220.010000.00322
Silver (Ag)7440-22-40.042280.346000.11147
subTotal12.22000100.0000032.21724
Mould CompoundFillerSilica fused60676-86-09.2371071.0000024.35302
PigmentCarbon black1333-86-40.039030.300000.10290
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.5629719.700006.75711
Phenolic resinProprietary1.170909.000003.08700
subTotal13.01000100.0000034.30003
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00002
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00004
Tin solderTin (Sn)7440-31-50.2699799.990000.71177
subTotal0.27000100.000000.71185
Solder PasteImpurityAntimony (Sb)7440-36-00.001360.030000.00359
Lead alloyLead (Pb)7439-92-14.1981492.4700011.06812
Silver (Ag)7440-22-40.113502.500000.29924
Tin (Sn)7440-31-50.227005.000000.59847
subTotal4.54000100.0000011.96942
total37.93000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.