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Chemical content PMEG4020EP-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG4020EP-QSOD128FlatPower38.11000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662871115112601235Seremban, Malaysia; Suzhou, China; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.78000100.000002.04671
subTotal0.78000100.000002.04671
ClipCopper alloyCopper (Cu)7440-50-87.2805299.8700019.10397
Iron (Fe)7439-89-60.007290.100000.01913
Phosphorus (P)7723-14-00.002190.030000.00574
subTotal7.29000100.0000019.12884
Lead FrameCopper alloyCopper (Cu)7440-50-812.1607399.5150031.90956
Iron (Fe)7439-89-60.011490.094000.03014
Phosphorus (P)7723-14-00.004280.035000.01122
Pure metal layerCopper (Cu)7440-50-80.001220.010000.00321
Silver (Ag)7440-22-40.042280.346000.11095
subTotal12.22000100.0000032.06508
Mould CompoundFillerSilica fused60676-86-09.2371071.0000024.23800
PigmentCarbon black1333-86-40.039030.300000.10241
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.5629719.700006.72519
Phenolic resinProprietary1.170909.000003.07242
subTotal13.01000100.0000034.13802
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00002
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00004
Tin solderTin (Sn)7440-31-50.2699799.990000.70840
subTotal0.27000100.000000.70848
Solder PasteImpurityAntimony (Sb)7440-36-00.001360.030000.00357
Lead alloyLead (Pb)7439-92-14.1981492.4700011.01584
Silver (Ag)7440-22-40.113502.500000.29782
Tin (Sn)7440-31-50.227005.000000.59564
subTotal4.54000100.0000011.91287
total38.11000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.