Chemical content PSMN2R8-40YSB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

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Type number	Package	Package description	Total product weight
PSMN2R8-40YSB	SOT669	LFPAK	75.25948 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934665895115	2	1	260		1	260			Cabuyao, Philippines; Hsin-chu, Taiwan

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	2.46048	100.00000	3.26933
		subTotal		2.46048	100.00000	3.26933

Clip	Copper alloy	Copper (Cu)	7440-50-8	4.99338	99.86762	6.63489
		Iron (Fe)	7439-89-6	0.00500	0.09991	0.00664
		Phosphorus (P)	7723-14-0	0.00162	0.03247	0.00216
		subTotal		5.00000	100.00000	6.64369

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	37.83076	99.87000	50.26710
		Iron (Fe)	7439-89-6	0.03788	0.10000	0.05033
		Phosphorus (P)	7723-14-0	0.01136	0.03000	0.01510
		subTotal		37.88000	100.00000	50.33253

Mould Compound	Filler	Silica fused	60676-86-0	13.74330	61.00000	18.26122
	Flame retardant	Zinc Borate	138265-88-0	2.25300	10.00000	2.99364
	Pigment	Carbon black	1333-86-4	0.06759	0.30000	0.08981
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	4.43841	19.70000	5.89748
		Phenolic resin	Proprietary	2.02770	9.00000	2.69428
		subTotal		22.53000	100.00000	29.93643

Post-Plating	Impurity	Non hazardous	Proprietary	0.00038	0.01000	0.00051
	Tin alloy	Tin (Sn)	7440-31-5	3.84962	99.99000	5.11512
		subTotal		3.85000	100.00000	5.11563

Solder Paste	Lead alloy	Lead (Pb)	7439-92-1	3.27358	92.50000	4.34972
		Silver (Ag)	7440-22-4	0.08848	2.50000	0.11756
		Tin (Sn)	7440-31-5	0.17695	5.00000	0.23512
		subTotal		3.53900	100.00000	4.70240

		total		75.25948	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.