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Chemical content PUSB3CB4

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Type numberPackagePackage descriptionTotal product weight
PUSB3CB4SOT1176-2XSON103.35365 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93466503247131260NA235Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0315045.000000.93928
PolymerAcrylic resinProprietary0.0105015.000000.31309
Phenolic resinProprietary0.0105015.000000.31309
Resin systemProprietary0.0175025.000000.52182
subTotal0.07000100.000002.08728
DieDoped siliconSilicon (Si)7440-21-30.06400100.000001.90837
subTotal0.06400100.000001.90837
Lead FrameCopper alloyCopper (Cu)7440-50-80.8986094.5900026.79484
Magnesium (Mg)7439-95-40.001620.170000.04816
Nickel (Ni)7440-02-00.041044.320001.22374
Silicon (Si)7440-21-30.006740.710000.20112
Pure metal layerGold (Au)7440-57-50.000280.030000.00850
Nickel (Ni)7440-02-00.001040.110000.03116
Palladium (Pd)7440-05-30.000480.050000.01416
Silver (Ag)7440-22-40.000190.020000.00567
subTotal0.95000100.0000028.32735
Mould CompoundFillerSilica -amorphous-7631-86-90.157507.000004.69638
Silica fused60676-86-01.8675083.0000055.68560
PigmentCarbon black1333-86-40.011250.500000.33546
PolymerEpoxy resin systemProprietary0.135006.000004.02546
Phenolic resinProprietary0.078753.500002.34819
subTotal2.25000100.0000067.09109
WireImpurityNon hazardousProprietary0.000000.000050.00000
Silver (Ag)7440-22-40.000000.001450.00001
Pure metalCopper (Cu)7440-50-80.0189796.548550.56559
Pure metal layerGold (Au)7440-57-50.000090.449960.00264
Palladium (Pd)7440-05-30.000592.999700.01757
subTotal0.01965100.000000.58581
total3.35365100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.