Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content RB521CS30L-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
RB521CS30L-QSOD882DFN1006-20.923599 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346677463151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.822868
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.113361
Phenolic resinProprietary0.00135313.5300000.146492
subTotal0.010000100.0000001.082721
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000003.248163
subTotal0.030000100.0000003.248163
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.945585
Magnesium (Mg)7439-95-40.0008200.2000000.088783
Nickel (Ni)7440-02-00.0129153.1500001.398334
Silicon (Si)7440-21-30.0028290.6900000.306302
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013317
Nickel (Ni)7440-02-00.0052071.2700000.563773
Palladium (Pd)7440-05-30.0006970.1700000.075466
subTotal0.410000100.00000044.391560
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000011.206162
Silica fused60676-86-00.27000060.00000029.233466
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.461673
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.243612
PigmentCarbon black1333-86-40.0022500.5000000.243612
PolymerEpoxy resin systemProprietary0.0315007.0000003.410571
Phenolic resinProprietary0.0270006.0000002.923347
subTotal0.450000100.00000048.722443
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000097
Non hazardousProprietary0.0000110.0555000.001202
Tin solderTin (Sn)7440-31-50.01998899.9400002.164143
subTotal0.020000100.0000002.165442
WireImpurityNon hazardousProprietary0.0000000.0100000.000039
Pure metalGold (Au)7440-57-50.00359999.9900000.389632
subTotal0.003599100.0000000.389671
total0.923599100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.