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Chemical content 74AHCT14D

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Type numberPackagePackage descriptionTotal product weight
74AHCT14DSOT108-1SO14123.13887 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352627601181712601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06326
PolymerAcrylic resinProprietary0.0152015.200000.01234
Resin systemProprietary0.006906.900000.00560
subTotal0.10000100.000000.08120
DieDoped siliconSilicon (Si)7440-21-30.15110100.000000.12271
subTotal0.15110100.000000.12271
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.25543
Iron (Fe)7439-89-61.068962.400000.86809
Phosphorus (P)7723-14-00.013360.030000.01085
Zinc (Zn)7440-66-60.044540.100000.03617
subTotal44.54000100.0000036.17054
Mould CompoundFillerSilica -amorphous-7631-86-90.465540.600000.37806
Silica fused60676-86-060.7762578.3300049.35586
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.732996.100003.84362
PigmentCarbon black1333-86-40.155180.200000.12602
PolymerEpoxy resin systemProprietary6.876038.862005.58396
Phenolic resinProprietary4.584025.908003.72264
subTotal77.59000100.0000063.01016
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00544
Nickel (Ni)7440-02-00.6499097.000000.52778
Palladium (Pd)7440-05-30.013402.000000.01088
subTotal0.67000100.000000.54410
WirePure metalCopper (Cu)7440-50-80.08776100.000000.07127
subTotal0.08776100.000000.07127
total123.13887100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.