Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHCT30BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHCT30BQSOT762-1DHVQFN1417.960001 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528976511510126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001295
FillerSilver (Ag)7440-22-40.01744575.0000000.097133
PolymerAcrylic resinProprietary0.0013966.0000000.007771
Resin systemProprietary0.00418718.0000000.023312
subTotal0.023260100.0000000.129510
DieDoped siliconSilicon (Si)7440-21-30.219060100.0000001.219708
subTotal0.219060100.0000001.219708
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.80297297.47000037.878463
Iron (Fe)7439-89-60.1675092.4000000.932680
Phosphorus (P)7723-14-00.0020940.0300000.011658
Zinc (Zn)7440-66-60.0069800.1000000.038862
subTotal6.979555100.00000038.861663
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.747866
FillerSilica -amorphous-7631-86-90.3671483.4900002.044254
Silica fused60676-86-08.92306484.82000049.682982
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054101.0020000.586918
PigmentCarbon black1333-86-40.0172530.1640000.096062
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893453.7010002.167846
Epoxy resin systemProprietary0.1668471.5860000.928993
Phenolic resinProprietary0.2370162.2530001.319686
subTotal10.520000100.00000058.574607
Pre-PlatingPure metal layerGold (Au)7440-57-50.0017721.0000000.009865
Nickel (Ni)7440-02-00.16123091.0000000.897718
Palladium (Pd)7440-05-30.0141748.0000000.078920
subTotal0.177176100.0000000.986503
WirePure metalCopper (Cu)7440-50-80.03953796.5500000.220140
Pure metal layerGold (Au)7440-57-50.0001430.3500000.000798
Palladium (Pd)7440-05-30.0012693.1000000.007068
subTotal0.040950100.0000000.228007
total17.960001100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.